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PCBA manufacturer have a very important link in the patch processing in PCBA technology workshop, that is, PCB welding, which needs tin before welding; Under normal circumstances, non professional PCBA may have bad conditions such as insufficient tin, which will have a direct impact on the appearance and even performance of PCB circuit board, and affect the quality and service life of PCBA processed products. If you want to avoid the occurrence of bad tin, you must first know the causes of these bad phenomena and solve them from the source. Here, ipcb briefly introduces the causes of poor tin on PCB summarized by professional PCBA manufacturers.
1. If the wettability of the flux used by PCBA manufacturer in CBA processing and production does not meet the standard, the tin will not be full when PCB soldering is carried out.
2. If the flux activity in the solder is not enough, the oxidizing substances on the PCB pad cannot be better removed.
3. In the PCBA workshop of patch processing, if the expansion rate of flux is very high in the PCBA processing and production process, it will be easy to be empty.
4. Serious oxidation occurs at the pad or SMD welding position.
5. If the amount of tin used in the soldering process of PCB circuit board is too small, the tin will not be full enough, but there will be a vacancy.
6. If the tin is not fully stirred before use, the flux and tin powder will not get sufficient fusion effect.
When a professional PCBA manufacturer carries out patch processing, if it can pay more attention to the above problems and implement them in place, it can effectively avoid the situation of insufficient tin during PCBA operation, so as to effectively avoid the problem of insufficient tin on the surface of PCB board to the greatest extent.
