PCBA manufacturer is now increasingly demanding the quality of PCBA welding in the production process. As far as the quality of PCBA plates is concerned, it is important that the reliability of PCBA plates start from the design stage. The U.S. Navy has found that 40%-60% of the malfunctions of military electronic products are caused by design problems. Now, IPCB from PCBA factory will explain for you two key points about the quality control of PCBA peak welding during PCBA processing in PCBA technology shop.
Concurrent management mechanism is used in product development. In production practice, welding defects caused by poor PCBA design by PCBA manufacturers are endless. For these defects, it is difficult to improve operation and innovate technology alone, which results in the embarrassing situation of "congenital shortage, acquired difficulties". Therefore, the quality control of PCBA's peak welding in SMT technology equipment should start from the design phase of PCBA and let the initial ideas run through the entire process before delivery packaging.
At the beginning of each new PCBA design, a mechanism of mutual trust and cooperation among design, process, production and quality inspectors should be established. That is to say, the only correct way to solve the welding defects caused by poor design is to carry out the parallel technical route for the early involvement of patch processing, production and quality inspectors in product development. Set up a strict management mechanism for the solderability of components. The solderability of metal surface depends on the removal of surface dirt and oxide film and the inherent temperature of the metal. Peak welding practice of PCBA in SMT equipment shows that keeping good solderability of lead of electronic components on PCB circuit board is the basis of obtaining good solder joints and an important measure to obtain the best production efficiency in patch processing plant.
It is often found in production that as long as the welded parts on the PCB circuit board can be welded well, even if the deviation of welding parameters is large, good welding results can be obtained, that is, the sensitivity to the fluctuation of process parameters in patch processing is very low. On the contrary, it is very sensitive to the fluctuation of the process parameters, the process window is very narrow, the operation is difficult, and the quality of the welding is not stable. Therefore, when purchasing components, PCB, terminal, etc., it is necessary to attach solderability and keep the temperature limit time to ensure the solderability of components in consideration of the technical conditions for the delivery of components.