PCBA Tech - What are the mistakes of PCB manufacturers when designing PCBA?

When PCBA is designed in SMT technology shop by PCB board manufacturer, it is easy for designers to make a mistake that they can not satisfy the environment in which PCBA runs at the design stage. Many PCBA processing factories will exclude environmental factors to evaluate as a cost reduction measure, and even require SMT technical designers to closely consider the cost of materials in PCBA design.

Environmental factors include: temperature, humidity and even G force will continuously act on PCB. If the materials and design specifications used are not sufficient in size and handling of these PCBA conditions, the PCBA will always fail. Depending on its location, this failure will cause enormous loss and increase the cost of capital for SMT patch processing plants.

PCBA assembly usually involves a large number of participants, including PCBA designers, manufacturers and electronics manufacturing service (EMS) providers. In general, PCB board manufacturers outsource manufacturing to different PCB factories for commercial reasons (such as lower costs and economies of scale) in PCBA design, and different participants need to communicate constantly. This will help PCB circuit boards to deliver high-quality products on schedule and smoothly.

Flexible cracking in PCBA design with SMT technology from PCB Factory generally means that PCBs that are over-bent under ceramic chip capacitors cannot withstand excessive stress due to their brittleness.

In order to obtain sufficient electrical performance, some printed PCBA board manufacturers increase the stress on the capacitor to a certain standard value to effectively prevent PCB from accidentally dropping or placing too much weight at any stage of assembly, so that the type of ceramic chip capacitor used in the SMT technology design stage should be able to handle the assembly pressure and should not be easily cracked.