PCBA Tech - smt patch thrust test and through-hole technology

SMT patch thrust test standard method and matters needing attention

Some precautions and methods must be paid attention to when we do thrust test for SMT patch components. The purpose of the toilet is to test the welding firmness and adhesion strength of the patch components.

1. Precautions for thrust test of SMT patch components:

1. Do not apply force quickly during measurement to avoid damage to the device;

2. The thrust test standards of different devices are not specified by customers and can be implemented with reference to related quality standards or IPC general inspection standards.

2. SMT chip component thrust test method:

1. After the production line is transferred to the production line, the IPQC needs to do the SMD component adhesion thrust test, and use the thrust meter to test the different specifications of the devices on the PCBA. The thrust meter needs to be reset to zero before the thrust test, so that the pointer points to "0". "Scale;

2. The use of thrust time calculation requires that the thrust meter and the tested material be at an oblique angle of 30 degrees to 45 degrees to apply force, and the force can be reached at a uniform speed and meet the specified standard requirements;

3. Test excellent products and non-excellent products need to be recorded on the corresponding record sheet for inspection;

4. After the test, the products that are not excellent must be placed separately and can be pulled down after being repaired and retested;

3. SMT chip component thrust test standard:

1,0603 greater than 0.8KG

2,0805 is greater than 1.0KG

3. 1206 is greater than 1.5KG

4. The diode is greater than 1.5KG

5. Transistor components are greater than 2.0KG

6. IC chip is greater than 3.0KG

7. The use of thrust time calculation requires that the thrust meter and the tested material be applied at an oblique angle of 30 degrees to 45 degrees, and the force can be reached at a uniform speed and meet the above-specified standard requirements.

The emergence of SMT patch and through-hole technology

Surface mount technology is a part of electronic components, which are responsible for mounting electronic components on the PCB surface. Electronic components mounted in this way are called surface mount devices (SMD). The purpose of developing SMT is to minimize manufacturing costs while effectively using PCB space. The introduction of surface mount technology allows PCB design services to be used for highly complex electronic circuits with smaller components. We will discuss the various advantages and disadvantages of surface mount technology in this article.

The emergence of SMT patch and through-hole technology

Surface mount technology was developed in the 1960s and was widely used in the 1980s. By the 1990s, they had been used in most high-end PCB components. The conventional electronic components have been redesigned to include metal lugs or end caps that can be directly connected to the surface of the board. This replaces the typical wire that needs to be drilled through. Compared with through-hole mounting, SMT can make components smaller, and components can be placed on both sides of the circuit board more frequently. Surface mount can achieve a higher degree of automation, thereby minimizing labor costs and increasing productivity, so as to achieve advanced PCB design and development.

Given below are the salient features of surface mount and through-hole technology:

Surface Mount Technology (SMT)

SMT allows electrical components to be mounted on the surface of the PCB without any drilling. These components have smaller leads or no leads at all, and are smaller than through-hole components. Since surface mount components do not require a lot of drilling, they are more compact and suitable for higher wiring density.

Through hole technology

For many years, through-hole technology has been used in almost all PCB circuit boards. This installation involves inserting the leads of the electronic components into holes drilled in the PCB and then soldering them to the pads on the other side of the PCB. Because the through-hole installation provides a firm mechanical bond, it is very reliable. However, drilling the PCB during the production process tends to increase the manufacturing cost. Moreover, SMT via technology limits the routing area of signal traces below the top layer of the multilayer board.