PCBA Tech - The key to SMT plug-in and placement equipment market

Four key elements of SMT plug-in

Generally, solders cannot provide high-quality mechanical support. The deep joint strength of SMT cartridges is much greater than that of surface assembly. Generally, it is because the cross-sectional area of SMT cartridges is hit; but because the impression is inserted into the through hole, it provides mechanical support. support. Generally, the thermal shock during the initial welding process, the red temperature cycle during the operation process, the hot drawing force, the twisting force and the lead metal are common to the connector.

There are four key elements in the design of SMT connectors: lead structure, molding compound, mechanical support and lead metal.

(1) Molding compound. Traditional thermoplastic materials have a low melting point and are not suitable for surface assembly and reflow soldering processes. High-temperature thermoplastic materials are suitable, but their high melting point increases the process difficulty and cost. . Both gull-wing and J-shaped pins can be used. However, because the J-shaped pin structure is to bend the lead under the component body, such a connection point is difficult to visually inspect. At present, only a few types of connectors adopt this structure.

(2) Mechanical support. Except for a few cases, SMT connectors should not only rely on welding as the only mechanical support method, but can use a variety of shaft-assisted support methods. The connector can be installed on the circuit board by riveting, crimping, winding or threaded connection.

(3) Lead structure. The important feature of SMT connector is that it has a certain degree of flexibility. Obviously, the flexible lead can not only compensate for the thermal expansion coefficient between the connector and the circuit board, but also buffer the insertion stress.

(4) Lead metal. In order to ensure sufficient welding strength, the electroplated metal of the connector lead must have a high solderability. Poor weldability not only causes problems in the production process, but also reduces the welding strength. Eutectic Sn-Pb coating provides higher solderability, while other coating effects are similar.

SMT placement equipment market will reach 4.6 billion US dollars

PR Newswire-PR Newswire/San Francisco, May 10, 2021, a new market research report released by Global Industry Analysts Inc. (GIA), the world’s leading market research company, was released today, titled "Surface Mount Technology ( SMT patch) equipment-global market trajectory". And Google Analytics.” The report puts forward new perspectives on the opportunities and challenges of tremendous changes in the market after COVID-19.

By 2027, the global surface mount technology (SMT chip) equipment market will reach 4.5 billion US dollars

In the COVID-19 crisis, it is expected that the global surface mount technology (SMT patch) equipment market in 2020 is expected to reach 3 billion US dollars in size of US$ 4.5 billion by 2027, which is 6.2% higher than the analysis cycle 2020 The compound annual growth rate from 2027 to 2027 shows. High-speed placement equipment is one of the market segments analyzed in the report and is expected to grow at a compound annual growth rate of 7%, reaching a market size of approximately US$2 billion before the end of the analysis period. After an early analysis of the commercial impact of the epidemic and the economic crisis it caused, it is expected that the growth of the medium-speed mounting equipment sector will spiral at a compound annual growth rate of 5.8% over the next 7 years.

The US market is estimated at US$30.23 billion, while the Asia-Pacific region is expected to grow at a compound annual growth rate of 6.5%

Surface mount technology (SMT patch) equipment in the US market is estimated to be $30.2.3 billion in the Asia-Pacific region in 2020 is expected to reach the projected market size US $1 billion has a trailing compound year of 6.5% during the analysis period 2020 The growth rate from 2027 to 2027 in other notable regional markets is Japan, China and Europe have compound annual growth rates of 4.9%, 7.2% and 3.9% from 2020 to 2027, respectively.

The low-speed placement equipment sector will record a compound annual growth rate of 4.8%

In the global low-speed placement equipment sector, the United States, Japan, China, and the Asia-Pacific region will drive the sector’s compound annual growth rate to an estimated 4.8%. The total market size of these regional markets in 2020 is 326.5 million U.S. dollars, and by the end of the analysis period, it is expected to reach 457.1 million U.S. dollars. China will remain one of the fastest growing countries in the SMT market in this region, and it is expected to reach 307.9 million US dollars by 2027.