PCBA Tech - How to program the patch on the SMT placement machine

1. Edit the optimized product program on the SMT placement machine

1. Call up the optimized program.

2. Make the image of PCB MarK and partial Mak.

3. Make images for the components that are not imaged, and register them in the image library.

4. Register the unregistered components in the component library.

5. For multi-tube vibrating feeders with unreasonable emissions, redistribute them according to the length of the device body, and try to arrange the devices with a relatively close device body length on the same rack: hold the material station tightly, Try not to have an idle material station in the middle, so as to shorten the distance of picking up components.

6. Change the multi-pin, narrow-pitch devices with larger outlines in the program, such as QFPs with more than 160 pins, large-size PLCC, BGA, and long sockets, to Single Pickup, which can improve the picking method. Installation accuracy.

7. Save to the disk to check whether there is any error message, and modify the program according to the error message until there is no error message after saving.

2. Proofreading check and backup patch program

1. According to the component list in the PCBA process file, check whether the component name, tag, model specification of each step in the program is correct, and correct the incorrect part according to the process file.

2. Check whether the components on each feeder station of the placement machine are consistent with the picking program table.

3. Use the main camera on the placement machine to check whether the X and Y coordinates of the components in each step are consistent with the component centers on the PCB. Check whether the corner Θ is correct according to the component position diagram in the process file, and correct the incorrect ones. (If you do not perform this step, you can correct it according to the actual placement deviation after the first SMT is placed)

4. Copy the completely correct product program to the backup U disk and save it.

6. Production can only be carried out after the proofreading and inspection are completely correct.

Causes of low placement efficiency of the placement machine

1. The suction nozzle of the placement machine in the smt patch processing is insufficient vacuum negative pressure on the one hand, or the suction nozzle of the placement machine automatically switches the mechanical valve on the placement head before picking the parts in the placement process, and the blow is converted to true It absorbs and generates a certain negative pressure. When the negative pressure sensor detects the value within a certain range after the parts are sucked, the machine is normal, otherwise the suction is bad. On the one hand, it is the pressure relief of the air source circuit, such as the aging and rupture of the rubber air pipe, the aging and wear of the seals, and the wear of the suction nozzle after long-term use. On the other hand, it is caused by the adhesive or the dust in the external environment, especially A large amount of waste generated by the components packaged in paper braid after cutting causes the suction nozzle of the placement machine to be blocked. 2. Errors in the settings of the placement machine program will also reduce the placement efficiency of the placement machine. The solution is to increase the training of the placement machine manufacturers to allow customers to get started faster. Thereby improving the proficiency and operation accuracy of SMT patch processing plant technicians.

3. The quality of the electronic component itself, the suction nozzle picks up the electronic component placement, and even the pin of the placement machine is not fully attached or directly bent or broken. In this case, the quality of the purchased and mounted components can only be well controlled. This will not only affect the mounting efficiency and product quality. The suction nozzle often picks up and mounts such components, and it will also cause varying degrees of damage., Over time, the service life of the nozzle will be reduced. Therefore, the regular maintenance of machinery and equipment in SMT patch processing is a very critical link.