PCBA Tech - About the introduction of SMT chip processing C line

1. Precautions for production in the trial production stage of SMT patch processing

1. Preparation for SMT patch processing

A. After learning from the PMC or the purchasing office that a certain model is ready for trial launch, you must know the person in charge of the development of the model and the person in charge of the biotechnology model in order to obtain relevant resources and help in the future;

B. Borrow a prototype: I need to have a simple understanding of the related functions of the machine produced, and have a good product machine full-function test several times;

C. Understand all post-welding components of the model, plan post-welding procedures, evaluate post-welding operations and pre-welding precautions;

D. Understand the use of test fixtures (there are often no test fixtures for the first trial production), and plan test items and procedures;

E. Understand the component layout of the entire PCB, and evaluate the characteristics of certain components for production considerations;

F. The SMT materials that biotechnology needs to prepare include "component location map", "BOM table" and "principle diagram". These materials must be the same version as the PCB produced;

G. It is best to prepare a sample before departure;

2. Material confirmation at the SMT chip processing plant: The material preparation and distribution technology cannot interfere, but several confirmations should be made after sending out. It is best to confirm with the development engineer:

A. First, understand the situation of material preparation. Whether the material is complete will determine the production arrangement. If the material is not complete, it should be reported to the factory immediately;

B. Confirmation of key materials, such as the version and material number of major materials such as FW IC, BGA, PCB board, etc.; material confirmation must check the BOM;

C. The general manufacturer’s IQC and material staff will also check the materials. If there are any inconsistent materials, they should immediately check with the development engineer;

3. First article confirmation

A. Confirm the first piece of the patch, pay attention to the direction and specifications of the main components, check the first piece record of the SMT manufacturer, and check the sample at the same time;

B. After the furnace, the PCB needs to look at the tin consumption of each component and the temperature resistance of the components;

C. It is best to work on the first post-welding part by yourself, and the development engineer confirms; at this time, start to prepare the post-welding process and post-welding SOP;

D. If there is a test fixture, test the first piece by yourself, and the development engineer confirms the test item, and begins to prepare the test item and test SOP;

4. Tracking and confirming the problem point

Record and sort out the problem points that occurred during the entire production process, including data, materials, placement, post-welding, testing, maintenance and other problems in the SMT patch processing process, and summarize them into a problem point tracking report, and be responsible for SMT production in time The human and the engineer of the development department confirm the problem.

5. Information feedback: After the SMT patch processing is completed, the problem should be reported to the relevant personnel.

A, SMT patch processing problem points are fed back to the person in charge of biotechnology models for review and improvement;

B. Collect the SMT problem points found in the trial investment in the factory and feed it back to the person in charge of SMT;

C. Feedback the improvement of the trial investment problem to the person in charge of SMT;

D. Track the improvement of problem points.

2. Precautions for SMT chip processing and production

A certain model has been mass-produced by the same manufacturer many times, and the process and flow are relatively familiar. In some cases, the following matters should be paid attention to:

1. Confirmation of test fixtures: Confirm the conditions of test fixtures and test accessories before production; collection of previous problems;

2. Special material confirmation: confirm the abnormal material before production, and confirm the material once;

3. First article confirmation: A. Make a brief understanding and test of the first article, and check the related first article records; B. Check whether the previous problem occurs again and whether the hand is improved; C. Confirm the previous SMT patch processing process and Whether the process needs improvement;

4. Analysis and confirmation of defective products: make a simple analysis of defective products, understand the distribution of main defects and the main causes of defects, and try to improve them;

5. Information feedback: A. SMT patch processing and production problem points are fed back to the person in charge of biotechnology models to remind attention; B. Assembly problem points in the factory are collected, fed back to the person in charge, and improvement is required.