PCBA Tech - Research and formulation of SMT corresponding standards

Compared with the rapid development of my country's electronic assembly technology, the research and formulation of SMT standards are still far behind the actual needs. The main problems are as follows:

(1) The quantity is small, the system is poor, and the completeness is poor

Compared with the hundreds of IPC standards, the number of SMT standards that my country has formulated is only more than ten, and the gap is quite large. Due to the small quantity, poor matching, lack of corresponding system and completeness, it is mainly reflected in only a single standard specification such as process technical requirements or material requirements, and no supporting and systematic standards such as design, management, process, testing and acceptance. Standard specification.

(2) Lack of practicality and operability

Since the existing standards are mostly based on technical requirements or general specifications, and lack of quantified specifications with strong practicability and operability such as technology, testing and acceptance, they are generally not practical and operability.

(3) Lack of advancement and openness

Various types of new components such as BGA, CSP, etc. continue to appear, and new technologies and new processes such as lead-free soldering technology, no-cleaning technology, high-density assembly technology, etc. continue to appear, forcing SMT and its corresponding standards to be in continuous development and progress. state. The SMT standard should be able to cope with this change and development, and always maintain its advanced nature and effectiveness. However, my country's current SMT standardization work is still relatively weak, and it is not possible to formulate or revise corresponding SMT standards or technical guidance documents in a timely manner like IPC, to reflect the development trend of new technologies and new processes, and to promote new technologies and new processes. Application and development.

What are the disadvantages of the research and formulation of SMT corresponding standards

For this reason, in actual domestic applications, in addition to the implementation of existing domestic standards, many occasions also need to implement or refer to relevant foreign standards such as IPC. There are also many electronic product companies that implement their own corporate standards based on actual needs.

In recent years, relevant departments have strengthened the construction of SMT standards. In response to the above-mentioned problems, they have proposed a plan to formulate the SMT standard system and its corresponding standards, and carry out the construction of SMT standardization scientifically, systematically and comprehensively. And has completed the design of the SMT standard system framework, some of which are already under formulation. The standard system includes general basic specifications for surface assembly technology, surface assembly technical conditions and process specifications, surface assembly process inspection and test specifications, surface assembly materials and inspection specifications, surface component quality evaluation and reliability test specifications, advanced assembly technology and surface assembly There are six major items in the informationization standard, and a total of more than 70 new standards are planned to be formulated. The construction and completion of this standard system is of great significance to the quality control of SMT and its assembly.