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The micro-assembly technology of SMT chip processing is actually the use of micro-welding and SMT chip processing on high-density multilayer interconnection substrates to assemble various micro-elements that make up electronic circuits to form a comprehensive technology for micro-electronic products.
1. Multi-chip module
The multi-chip component in the PCBA package is a high-tech electronic product developed on the basis of a hybrid integrated circuit. This technology assembles multiple LSI and VLSI chips on a hybrid multilayer interconnection substrate at high density. Encapsulated into a shell, it is a highly mixed integrated component. The MCM chip interconnection assembly technology of SMT chip processing is to assemble the components and devices on the MCM substrate in a specific connection method, and then install the substrate of the assembled components in the package to form a multifunctional MCM assembly. The MCM chip interconnection assembly technology includes: the bonding of the chip and the substrate, the electrical connection between the chip and the substrate, the physical connection and the electrical connection between the substrate and the housing.
2. Flip Chip FC Technology
The flip-chip technology of SMT chip processing is to realize the interconnection between the chip and the circuit board through the bumps on the chip. Generally, the chip is placed on the circuit board in reverse. The gold wire bonding technology generally uses the surrounding parts of the chip, while the flip chip solder bump technology uses the entire chip surface, which can make the packaging density of the flip chip technology higher and reduce the size of the device. The flip chip technology in PCBA packaging includes: solder paste flip chip assembly process, solder pillar bump flip chip bonding method, and controllable collapse connection C4 technology.
Three, package stacking
The emergence of PoP stacking assembly technology in PCBA packaging materials has blurred the boundaries between first-level packaging and second-level assembly. It not only improves logic operation functions and storage space, but also provides end users with the possibility of freely choosing device combinations. Controlled production costs. The main function of the PoP package is to integrate high-density digital or mixed-signal logic devices in the bottom package, and to integrate high-density or combined storage devices in the top package.
4. Optoelectronic interconnection technology
1. Optoelectronic board-level packaging SMT chip-based optoelectronic board-level packaging is to integrate optoelectronic devices and electronic packaging to form a new board-level package. This board-level package can be regarded as a special multi-chip module that contains: optical circuit substrates, optoelectronic devices, optical waveguides, optical fibers, optical connectors and other devices.
2. Optoelectronic components and modules Optoelectronic components and modules are optoelectronic circuit components or modules formed by optoelectronic packaging technology. Copper conductors for transmitting electrical signals and optical paths for transmitting optical signals can be fabricated on a substrate.
3. Hierarchical structure of optical circuit assembly Optical circuit assembly generally consists of 6 levels. Chip level, device level, MCM level, board level, component level, system level.
