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SMT is an assembly technology that directly attaches or solders local components or micro-components suitable for surface assembly to a specified position on the surface of a printed or other substrate without drilling insertion holes on the printed circuit board.
Because the geometric size and space volume of various chip components are much smaller than those of plug-in components, this assembly form has the advantages of compact structure, small size, vibration resistance, impact resistance, high frequency characteristics and high production efficiency. When double-sided mounting is used, the assembly density is about 5 times higher, so that the printed board area is saved by 60%-70% and the weight is reduced by more than 90%.
SMT is used in investment electronic products, military equipment, computers, communication equipment, color TV tuners, video recorders, digital cameras, camcorders, digital camcorders, pocket high-end multi-band radios, walkmans, MP3s, pagers and mobile phones. All electronic products are widely used in the production. SMT is the main development direction of electronic assembly technology and has become the mainstream of the world's electronic assembly technology.
SMT is developed from the evolution of thick and thin film hybrid circuits.
The United States is the country where SMD and SMT originated first in the world, and has always attached importance to the advantages of SMT's high assembly density and high reliability in the field of investment electronic products and military equipment, and has a very high level.
Japan introduced SMD and SMT applications from the United States in the field of consumer electronics in the 1970s, and invested world capital to vigorously strengthen the development and research of basic materials, basic technologies, and popularization and applications. From the mid to late 1980s, it accelerated the use of SMT in industrial electronics. The comprehensive promotion and application in the field of equipment has only taken four years to increase the number of applications of SMT in computers and communication equipment by nearly 30%, and in fax machines by 40%, making Japan soon surpass the United States, and it is in the SMT area. Leading position in the world.
SMT in European countries started late, but they attach importance to development and have a good industrial foundation, and the speed of development is also very fast. The level of development and the efficiency of SMC/SMD in the whole machine are second only to Japan and the United States. Since the 1980s, the Asian Four Dragons of Singapore, South Korea, Hong Kong and Taiwan Province have invested huge sums of money and have introduced advanced technologies to enable SMT to develop rapidly.
The general development trend of SMT is: components are getting smaller and smaller, the assembly density is getting higher and higher, and the assembly difficulty is getting bigger and bigger. In recent years, SMT has entered a new development climax. In order to further adapt to the development of electronic equipment in the direction of short, small, light and thin, 0210 (0.6mm*0.3mm) CHIP first year, BGA, CSP, FLIP, CHIP, composite chip components and other new packaging components appeared. Due to the development of BGA and other component technologies, the emergence of non-ODS cleaning and lead-free solder has caused changes in SMT equipment, soldering materials, placement and soldering processes, and promoted the development of electronic assembly technology to a higher level. The rapid development of SMT is indeed surprising. It can be said that it changes every year, every month, and every day.
