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The following mainly introduces the main design content of the SMT quality management system:
SMT product assembly quality management is the main content of SMT product assembly system management, and the corresponding quality management system is the core component of the quality management system of SMT product manufacturers. SMT product assembly quality
SMT product assembly quality management is the main content of SMT product assembly system management, and the corresponding quality management system is the core component of the quality management system of SMT product manufacturers. The SMT product assembly quality management system aims at the production characteristics of SMT products and the requirements of high quality and high efficiency, and solves the assembly quality and management issues that are common in the production process of SMT product assembly systems, involving assembly process design, quality verification, and material quality management., Production preparation process quality verification, assembly process quality control, assembly quality inspection, product user service and other links, highlighting the advancement, reliability, timeliness, high quality and economy of the SMT assembly system or enterprise.
SMT product assembly quality management is to follow the ISO 9000 family of standards and the eight principles of modern quality management, through the quality control and management of the five major factors of people, machines, materials, methods, and the environment, to pursue the best SMT product assembly quality as the management goal. system.
The establishment of the SMT product assembly quality management system is based on the principle of implementing prevention and total quality management as the guiding principle. According to the various quality control and management needs in assembly production, the following main contents are designed to build a structure that can adapt to SMT A complete quality management system for product assembly quality control and management.
Intelligent control system motherboard smt patch plus
(1) Analysis and determination of quality control content;
(2) Design and arrangement of quality control points;
(3) Selection and determination of quality inspection methods and control techniques;
(4) Quality testing equipment and its information, environment and other resource allocation;
(5) Quality data collection, analysis, processing, and feedback system design and related technology research;
(6) Formulation of quality standards and specifications, establishment of product quality tracking system, etc.
2. Testing equipment for SMT patch processing
The manufacturing process of SMT patch processing is very complicated. Each process is linked to each other. Any problem in the process will affect the quality of the product. In order to improve the welding quality of the PCBA processing of the product, it is necessary to set up professional testing equipment in each process to strictly control the quality of the process.
The following mainly introduces what are the testing equipment for SMT patch processing?
1. SPI Inspection SPI is the solder paste thickness gauge, which is generally placed behind the solder paste printing process. It is mainly used to detect the distribution of the thickness, area and volume of the solder paste on the PCB. It is an important equipment for monitoring the quality of solder paste printing. .
2. AOI detection AOI is an automatic optical detector, which can be placed in various positions of the production line, but it is generally placed behind the reflow soldering process to detect the soldering quality of the PCB board after reflow soldering, and find that there is less tin and less material in time, Welding, solder joints and other defects.
Explain the importance of AOI inspection equipment for SMT patch processing:
During automatic inspection, the machine automatically scans the PCB through the camera, collects images, compares the tested solder joints with the qualified parameters in the database, after image processing, checks out the defects on the PCB, and displays/marks the defects through the display or automatic signs Come out for improvement by SMT process engineers and repair by SMT maintenance personnel. The automatic optical detector is a very widely used inspection equipment in SMT patch factories today, and it has a tendency to gradually replace manual inspection.
3. X-RAY Inspection X-RAY is the X-ray commonly used in hospitals. It uses high-voltage impact on the target to produce X-ray penetration to detect the quality of the internal structure of electronic components, semiconductor packaging products, and the welding quality of various types of solder joints of SMT. It is mainly used to detect BGA chips with pins located below, and can detect defects such as bridges, voids, excessive solder joints, and small solder joints on the BGA. Some objects that are invisible on the surface can be detected by X-RAY. Generally the price is more expensive, and it is less used in small and medium-sized enterprises
