PCBA Tech - BGA Electronic packaging technology

BGA Electronic packaging technology reliability evaluation is a work item that needs to be evaluated. Before the new package is applied to the complete model, its reliability should be evaluated and verified according to the environmental characteristics of the application and the reliability requirements of the complete machine.

Similarly, the reliability evaluation of BGA Electronic packaged devices also needs to be carried out from the two dimensions of the device package itself and the device reliability after assembly. The evaluation of the device package itself should mainly be carried out from the aspects of package design, structure, material and process, and computer simulation analysis; and the package reliability evaluation after the device is assembled, mainly through the environmental, mechanical and other stresses and the computer Simulation analysis to evaluate the reliability of the whole machine. At the same time, different packages have different requirements for the electrical assembly process. PCBA processing and manufacturing companies need to analyze the adaptability of the assembly process according to the characteristics of the package structure.

1. BGA Electronic packaging technology reliability evaluation process
The basis for the implementation of package reliability evaluation is demand analysis, which is divided into two aspects: the device structure itself and the application environment. These requirements include electrical adaptability, mechanical adaptability, thermal adaptability and electrical equipment process adaptability. The evaluation process can be divided into two parts. One part uses computer simulation analysis as the main method, combined with the structural characteristics of the package to simulate actual working conditions for simulation analysis; the other part uses test methods to analyze the physical and environmental adaptability of the physical package structure.

The simulation analysis starts with the signal integrity analysis, the electrical performance is the basic requirement of the device, and the mechanical and thermal characteristics are the reliability requirements. According to the structural model of the device, the mechanical characteristics and thermal characteristics are analyzed. The two can be performed serially or in parallel, or even the same model can be used at the same time. After completing the three aspects of the analysis, a comprehensive analysis can draw a conclusion. The physical analysis process should be carried out for packaged products, and representative samples should be selected. The samples are generally divided into two groups. One group only analyzes the package of the sample itself, and the other group needs to analyze the reliability of the product in the application environment (environmental, mechanical) after assembly. During the analysis process, the phased results of the two groups of samples in the analysis process support each other, and finally it is necessary to comprehensively analyze the analysis results of the two groups of samples and give an evaluation conclusion.

2. Reliability evaluation plan for BGA Electronic packagingdevices
The weak points of the reliability of BGA Electronic packaging are the solder balls, bonding density and bonding wire length, as well as the soldering of chip bumps (for flip-chips). In addition, the integrity of multiple channels, power, and ground signals of BGA packaged devices needs special consideration, so signal integrity analysis is an important part of BGA Electronic packaging simulation analysis.