PCBA Tech - SMT small batch placement processing quality control

Ensure the quality of the production process of SMT small batches (500 sets and below orders), and reduce customer complaints.

2.0 Scope of application

This process is suitable for the quality control of all SMT small batch chip processing in SM factory.

3.0 Responsibilities:

3.1 Material staff: Responsible for taking out the required materials according to the order requirements, etc.;

3.2 Operator: Prepare the required production materials and other work in advance according to the plan of the day;

3.3 Verifier: Accurately measure and verify the characteristic values of various materials according to the material station table;

3.4 QC personnel: inspect the quality of materials and welding;

3.4 Technician: Responsible for program switching and debugging of production orders, improving and enhancing the quality of production products.

SMT small batch chip processing quality control process

4.0 Procedure:

4.1 During the material picking process, the material clerk visually inspects whether there are creases in the materials issued by the warehouse, and all materials with creases are fed back to the warehouse and returned;

4.2 The material clerk confirms whether the bulk materials of precision sensitive devices such as ICs have secondary vacuum packaging during the picking process, if not, they will refuse to accept it. When receiving the board, the WIFI board and the sub-board with a precision of 0.4Pitch IC refuse to accept the loose board, and the production quality cannot be guaranteed when the production line is off;

4.3 In the process of receiving materials and preparing materials, the operator first confirms whether the materials have creases. When receiving materials, the same feeder can only receive two sections of materials. During the process of receiving materials and cutting the material belt, the material ends of the two sections need to be cut. Relatively overlapping, the two pieces of material can be cut when the holes are aligned, so as to ensure that the aperture distance of the two pieces of material meets the standard, reducing or avoiding the difference of the feeding position at the joint and the defects such as throwing and suction side standing, 1608 (English 0603) ) And above devices because of the thick braid, it is difficult to overlap and align the cutting. You can cut the strip by cutting a semicircular hole on a single braid, and then splice the material;

4.4 When material verification QC verification and testing, the test can only be taken from both ends of the two pieces of materials that have been connected. It is strictly forbidden to take material from the middle of the braid to avoid the failure of the placement machine equipment due to man-made damage to the middle braid. materials;

4.5 When the current order enters the cleaning phase (subject to 10 boards), the operator brushes out the back boards in advance, and prepares the materials required for the next order. The technician starts to switch the solder paste machine program in advance, and Parameter adjustment and confirmation are completed, in order to reduce the debugging time and quality problems caused by unstable printing when the machine is off, the operator can only start printing after the current planned order has checked the materials, and it is not allowed to brush the board in advance to avoid solder paste change Quality problems caused by dryness;

4.6 PCBA technicians switch programs and debug the models ordered, carefully confirm whether the mounting conditions of the newly produced boards meet the technical requirements, and track the production quality status online and debug the problem points in time. In order to stabilize production quality;

4.7 In the first hour of production, the personnel in front of the furnace do a visual inspection of all the boards, and feedback the broken machine to the technician to adjust the machine (such as side erection, offset, overturning, etc.). The technician should check and analyze the cause of the broken machine in time. Handle, and track whether the result after debugging is normal.

4.8 When the QC after the furnace is testing the board, carefully check whether the welding meets the requirements. For some key components, special-shaped components (such as terminal devices, main chip QFP package IC), after the automatic test is completed, visually inspect the soldering again. The effect is to prevent welding and other problems caused by AOI blind spots from being missed to the client.

4.9 In order to ensure the quality control of SMT batch placement processing, each team must strictly follow the above requirements. For those that do not comply with the requirements, they will be evaluated according to the departmental quality inspection system.