What is dip vs smt?
smt is surface mount technology (abbreviation of Surface Mount Technology), which is currently the most popular technology and process in the electronic assembly industry. It is a circuit assembly technology in which surface mount components are mounted on the surface of a circuit board or the surface of other substrates, and are soldered and assembled by methods such as reflow soldering or dip soldering.
smt materials are mainly surface mount components, such as resistors, capacitors, and single-chip microcomputers on the internal surface of mobile phones. They are soldered using surface assembly technology. Usually, they go through the following processes during production:
Solder paste printing: The solder paste is printed on the surface of our PCB board by hand or machine.
Component placement: use manual or placement machine to mount smt components on the printed PCB board.
Reflow soldering: through the process of gradual heating, the solder paste is melted at a certain temperature, and the mounted components and the PCB board are effectively soldered together to achieve reliable electrical performance.
The advantages of the smt processing method are that these components occupy a small space, have a very high production efficiency, and have fewer problems.
dip, the abbreviation of Dual In-line Package, refers to a device packaged in a plug-in form, and the number of pins generally does not exceed 100. The frequently mentioned "dip soldering" or "post-dip soldering" refers to the soldering of dip packaged devices after smt.
dip materials are mainly in-line components, such as electrolytic capacitors on computer motherboards, power transformers, transistors, etc., which are mainly processed by manual welding or wave soldering. Compared with smt materials, the processing technology is different. And the cost is much higher than the patch. At present, most of the welding industry is mainly based on smt material welding, with only a small number of dip components, and some special products will basically use dip components, such as power supplies.
PCB Assembly of smt process
What is the difference between dip vs smt?
The difference between dip vs smt
smt patch is generally mounted with no-lead or short-lead surface assembly components. It is necessary to print solder paste on the circuit board, then mount it through a placement machine, and then fix the device through reflow soldering. The dip welding is a direct-insertion packaged device, which is fixed by wave soldering or manual soldering.
dip vs smt is part of PCBA processing, but not all PCBA factories have dip vs smt post-welding capabilities, and the processing quality is also uneven. When choosing a PCBA factory for cooperation, it is recommended to go to the factory for on-site inspections to see the factory personnel skills, processing equipment, and the overall environment of the factory. ipcb can provide high-quality smt patch and dip post-welding services.