PCBA Tech - How to solve the problem of PCBA high-density double-sided assembly

How to solve the problem of PCBA high-density double-sided assembly
In order to meet the development requirements of light, thin, short, small, multi-functional, and highly reliable electronic products, the proportion of electronic product structures using PCB hybrid assembly technology is increasing. Not only is THC/THD and SMC/SMD mixed assembly more and more common, it is not uncommon for THC, THD, SMC, SOIC, etc. to be mixed on a PCB at the same time.

Usually more than 95% of the SMD components and a few different components, such as connectors, transformers, etc., are assembled in PCBA. The assembly of these components is supplemented by equipment and processing systems other than SMT in cooperation with the wave soldering production line. The high energy consumption and the consumption of a large amount of flux, solder and nitrogen make the wave soldering process very uneconomical at this time, and when wave soldering double-sided PCB boards, the solder temperature in the solder tank often makes the top device solder joints A secondary remelting occurred. At the same time, the PCB is bent and deformed. Therefore, we must use the following methods to solve.

1. Try not to use manual soldering iron for welding

In the field of assembled circuit boards that require high quality and high reliability, manual soldering is not allowed. Poor process repeatability makes manual welding regarded as a hidden danger that affects quality.

2. Use solder mask to protect PCBA

Use a complex solder mask to protect the components on the PCB soldering surface and avoid contact with flux and solder. Today's electronic products must meet strict quality standards, especially the residue left on the PCB after soldering will cause PCBA pollution, which will continuously reduce the surface impedance of the circuit board for a long time. Therefore, a solder mask is required to protect the PCBA board.

3. Selective welding process

The selective soldering process is suitable for the soldering of through-hole components, usually SMT components dominate, and through-hole components only account for a small proportion of all components on the PCBA, but this mounting method will still be very important. It will continue for a long time.

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