PCBA Tech - The influence factors of tin on PCBA

PCBA processing precautions
At present, the country has higher and higher requirements for environmental protection and greater efforts in link governance. This is a challenge but also an opportunity for PCB factories. If PCB factories are determined to solve the problem of environmental pollution, then FPC flexible circuit board products can be at the forefront of the market, and PCB factories can get opportunities for further development.
The choice from tin to PCBA in the PCBA processing process is also crucial. In the through-hole insertion process, the tin penetration of the PCB board is not good, and it is easy to cause problems such as virtual soldering, tin cracks and even missing parts.
About PCBA, we need to understand through tin

1. PCBA and tin
According to IPC standards, PCBA through-hole solder joints generally require more than 75% soldering. In other words, check that the hole height of the panel surface is not less than 75% (board thickness) during soldering, and the PCBA is suitable for 75%-100% through tin. The plated through holes are connected to the heat dissipation layer or the heat dissipation layer that plays a role of heat dissipation. PCBA tin penetration requires more than 50%.

The second is the influence factors of tin on PCBA

PCBA tin penetration is mainly affected by factors such as material, wave soldering process, flux, and manual soldering.
Specific factors affecting PCBA through tin

1. Materials
Tin melted at high temperature has strong permeability, but not all soldering metals (PCB boards, components) can penetrate into it. For example, metal aluminum generally automatically forms a dense protective layer on its surface, and the difference in internal molecular structure also makes it difficult for other molecules to penetrate. Second, if there is an oxide layer on the surface of the weld metal, it will also prevent the penetration of molecules. We generally use flux treatment or gauze brush to clean.
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