What are the requirements of PCBA welding process for PCB board?
During the PCBA welding process, due to PCBboard problems, it will often increase PCBA welding process difficulty and welding defects. In order to facilitate PCBA welding and assembly, the circuit board must meet the manufacturability requirements in terms of size and pad distance.
The requirements of PCBA welding for PCB boards are as follows:
1. PCB size
The width of the PCB (including the edge of the board) should be greater than 50mm and less than 460mm, and the length of the PCB (including the edge of the board) should be greater than 50mm. If the size is too small, it needs to be made into a jigsaw.
2. PCB board edge width
Board edge width: >5mm, panel spacing: <8mm, distance between pad and board edge: >5mm
3. PCB bending
Upward bending degree: <1.2mm, downward bending degree: <0.5mm, PCB distortion: maximum deformation height ÷ diagonal length <0.25
4. PCB board mark point
Mark shape: standard circle, square, triangle;
Mark size; 0.8~1.5mm;
Mark material: gold-plated, tin-plated, copper and platinum;
Mark's surface requirements: the surface is flat, smooth, non-oxidized, and free of dirt;
Mark's surrounding requirements: there should be no green oil or other obstacles within 1mm around, which is obviously different from the Mark's color;
Mark position: 3mm or more from the edge of the board, and there can be no Mark-like vias, test points, etc. within 5mm around
5. PCB pads
There are no through holes on the pads of SMD components. If there is a through hole, the solder paste will flow into the hole, resulting in less tin in the device, or the tin flowing to the other side, causing the board surface to be uneven and the solder paste cannot be printed.
When conducting PCB design and production, it is necessary to understand some knowledge of PCBA welding process, so as to make the product suitable for production, help to improve the welding yield and reduce the cost of production.
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