PCBA Tech - SMT patch rework workflow

SMT patch rework workflow
In the production process of SMT chip processing, there will be some processing defects or undesirable phenomena that we do not want to see occasionally. For PCBA products with problems, we cannot let them flow into the next processing link or even leave the factory. The repair process of SMT processing components is divided into three steps:

Desoldering and disassembly

1. Remove the coating first, and then remove the residue on the working surface.

2. Install a hot-clamping soldering iron tip with a suitable shape and size in the hot-clamping tool.

3. Set the temperature of the soldering iron tip to around 300°C, which can be changed as needed.

4. Apply flux to the two solder joints of the chip component.

5. Use a wet sponge to remove oxides and residues on the tip of the soldering iron.

6. Place the soldering iron tip on top of the SMT component, and clamp the two ends of the component to contact with the solder joints.

7. Lift the component when the solder joints at both ends are completely melted.

8. Place the removed components in a heat-resistant container.

Pad cleaning

1. The chisel-shaped soldering iron tip is selected, and the temperature is set at about 300 degree Celsius, which can be changed appropriately according to needs.

2. Brush the soldering flux on the pads of the circuit board.

3. Use a wet sponge to remove oxides and residues on the tip of the soldering iron.

4. Put a soft tin-absorbing braid with good solderability on the pad.

5. Gently press the soldering iron tip on the solder-absorbing braid. When the solder on the pad is melted, move the soldering iron tip and the braid slowly to remove the residual solder on the pad.

Assembly welding

1. Choose a soldering iron tip with a suitable shape and size.

2. The temperature of the soldering iron tip is set at about 280 degree Celsius, which can be changed appropriately as required.

3. Brush the soldering flux on the two pads of the circuit board.

4. Use a wet sponge to remove oxides and residues on the tip of the soldering iron.

5. Use an electric soldering iron to apply an appropriate amount of solder on a pad.

6. Use the insert to clamp the SMT patch component, and use an electric soldering iron to connect one end of the component to the soldered pad to fix the component.

7. Use an electric soldering iron and solder wire to solder the other end of the component to the pad.

8. Solder the two ends of the component with the pads respectively.
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