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1. Product introduction of black fr4 pcb insulation board
Black fr4 pcb insulation board, also known as fiberglass board, is generally used for soft base, and then wrapped with cloth and leather to make beautiful wall and ceiling decoration. It is widely used. With sound absorption, sound insulation, heat insulation, environmental protection, flame retardant and other characteristics. Black fr4 pcb insulation board, also known as fiberglass board; Glass fiber board; Fr4 pcb reinforcing plate; FR-4 epoxy resin board; Flame retardant insulating board; Epoxy board, fr4 pcb light board; Epoxy glass cloth board; Drill base plate for circuit board.
black fr4 pcb
Black fr4 pcb insulation board alias: glass fiber insulation board, glass fiber board (FR-4), glass fiber composite board, which is composed of glass fiber material and high heat resistance composite material, and does not contain asbestos harmful to human body. It has high mechanical and dielectric properties, good heat resistance and moisture resistance, and good processability. For plastic mold, injection mold, machinery manufacturing, molding machine, drilling machine, injection molding machine, motor, PCB.ICT fixture, table grinding pad.
Injection molding usually requires high temperature material and low temperature mold. The thermal insulation method must be adopted under the condition of the same machine. Keep the injection molding temperature low and do not make the injection molding machine temperature too high. This requirement can be met by installing an insulation board between the injection mold and the injection machine. Shorten the production cycle, improve productivity, reduce energy consumption, improve the quality of finished products. The continuous production process ensures the stability of product quality, prevent the machine from overheating, no electrical failure, and no oil leakage in the hydraulic system.
2. Features of black fr4 pcb insulation board
Main technical characteristics and application of black fr4 pcb insulation board: stable electrical insulation performance, good flatness, smooth surface, no pits, thickness tolerance exceeding the standard, suitable for products with high performance electronic insulation requirements, such as FPC reinforcing plate, high-temperature resistant plate of tin furnace, carbon diaphragm, precision planetary wheel, PCB test frame, electrical (electrical) equipment insulation partition, insulation pad, transformer insulation, motor insulation, Deflection coil terminal board, electronic switch insulation board, etc. It is also known as the black fr4 pcb insulation board, which is generally used for soft base, and then wrapped with cloth and leather to make beautiful wall and ceiling decoration. It is widely used. With sound absorption, sound insulation, heat insulation, environmental protection, flame retardant and other characteristics.
Black fr4 pcb epoxy resin refers to organic polymer compounds with two or more epoxy groups in the molecule. Except for a few, their relative molecular weight is not high. The molecular structure of epoxy resin is characterized by the presence of active epoxy groups in the molecular chain. The epoxy groups can be located at the end, middle or ring structure of the molecular chain. Due to the active epoxy groups in the molecular structure, they can react with various types of curing agents to form insoluble and insoluble polymers with three-dimensional network structure.
Characteristics: All kinds of resin, curing agent and modifier systems can almost meet the requirements of various applications on the form, ranging from extremely low viscosity to high melting point solids. Different curing agents are used for curing. The epoxy resin system can be cured in the temperature range of 0~180 ℃. Strong adhesion: the existence of inherent polar hydroxyl and ether bonds in the molecular chain of epoxy resin makes it have high adhesion to various substances. The shrinkage of epoxy resin during curing is low and the internal stress generated is small, which also helps to improve the adhesion strength.
Strong shrinkage: the reaction between epoxy resin and curing agent used is carried out by direct addition reaction or ring-opening polymerization of epoxy group in resin molecule, without water or other volatile by-products. Compared with unsaturated polyester resin and phenolic resin, they show very low shrinkage (less than 2%) during curing. Mechanical properties: The cured epoxy resin system has excellent mechanical properties.
Electrical properties: The cured epoxy resin system is an excellent insulating material with high dielectric properties, surface leakage resistance and arc resistance. Chemical stability: Generally, the cured epoxy resin system has excellent alkali resistance, acid resistance and solvent resistance. Like other properties of curing epoxy system, chemical stability also depends on the selected resin and curing agent. Proper selection of epoxy resin and curing agent can make it have special chemical stability on the black fr4 pcb.
