PCB Blog - SOP package classification and process flow analysis

SOP package is a form of electronic components,one of the surface mount package,the more common packaging materials are:ceramic, glass, plastic, metal, etc., the current basic use of plastic packaging,mainly used in a variety of integrated circuits.

SOP device is also known as SOIC (Small Outline Integrated Circuit,) is a reduced form of DIP, the lead center distance of 1.27mm, the material has plastic and ceramic two kinds of SOP is also known as SOL and DFP. SOP package standards are SOP-8, SOP-16, SOP-20, SOP-28 and so on. SOP after the number of pins, the industry tends to omit the "P", called SO (Small Out-Line).

SOP (Small Outline Package) small outline package, refers to the gull-wing-shaped L-shaped) leads from the two sides of the package out of a surface mount package. 1968 ~ 1969 Philips developed a small outline package (SOP). Later gradually derived SOJ (type pin small outline package), TSOP thin small outline package), VSOP (very small outline package), SSOP (reduced SOP), TSSOP (thin reduced SOP) and SOT (small outline transistor), SOIC (small outline integrated circuits) and so on.

In the pin number star does not exceed 40 in the field, SOP is the most widely spread surface mount package, the typical write pin center distance 127mm (150mi), the other 0.65mm, 05mm; write the number of pins more than 8 ~ 32; assembly height of less than 1.27mm SOP is also known as TSOP.

1.Features of SOP aging seat

①Double contact technology, stable contact.

②Seat shell adopts special engineering plastic, high strength, long life.

③Shrapnel adopts imported beryllium copper material, small impedance, elasticity, long life.

④The gold plating layer is thickened, and the contacts are thickened and plated, with stable contact, ultra-low contact impedance and high antioxidant degree.

⑤ Apply to the standard package chip with the pitch of 0.5, 0.635, 0.65, 1.27mm.

2.Parameters of SOP aging socket

①socket body: PEI

②Shrapnel material: beryllium copper

③Shrapnel plating: nickel gold

④Operating pressure: 0.9KG min, the more PIN the greater the pressure

⑤Insulation impedance: 1,000MΩ 500V DC

⑥Maximum current: 1A

⑦Operating temperature: -40℃~155

⑧Mechanical life: 15,000 times

SOP encapsulation process is a surface mount (SMD) encapsulation manufacturing process.SOP encapsulation process flow is, first thinning, scribing, and then the IC chip will be pasted on the carrier of the SOP lead frame, after baking, bonding (wire bonding) so that the chip to the chip, chip and the inner pins to connect, and then after the molding will be bonded to the chip wire, the inner pins and other packages, and finally through the post-curing, marking, electric town, Finally, through the post-curing, marking, electric town, cutting and molding, testing, complete the entire SOP production process.

SOP Package Process Standard Flow

(1)Thinning:The discs with gold backing (silver backing) are not thinned. The non-gold (silver) backed discs are thinned by rough grinding and fine grinding methods of the original discs.

(2)Scribing:According to the packaging needs, choose ordinary blue film, DAF (Die Attach Film) film CDAF (Conductive Die Attach Film) film or UV (Ultra-violet Rays Fim) film. At present, the main use of steel blade mechanical cutting or laser cutting process.

(3)loading:the use of adhesive film glue,adhesive film sheet and UV film on the core of the kind of process.

(4)bonding:that is, playing the line,welding line with gold wire,copper wire,silver alloy wire and aluminum wire and other materials,using ultrasonic thermal bonding process.

(5)Plastic sealing:SOP using injection molding process.

(6)Post-curing:Use the oven to bake the molded products at high temperature.

(7)Marking:Use laser marking machine on the front of the product to generate the product logo (formerly known as "printing").

(8)Electroplating:Pure tin electrodeposition process is used.After tinning, the product needs to be baked.

(9)Cutting and molding:On the integrated machine for cutting and molding,first punch the waste, cut off the middle bar, and then molding, self-strengthening human tube.

(10)Testing:Adopt the integrated testing technology of tubing or braiding.

SOP package is not only the standardization and normalization of the operation process, but also the double guarantee of efficiency and quality. Through SOP packaging, enterprises can ensure that every employee can work in accordance with the established standards and procedures, thus reducing errors and deviations caused by human factors.