PCB Blog - IC substrate vs PCB

The difference between IC substrates and PCBs lies in their different functions and application fields. The IC substrate is mainly used for the connection and temporary storage of integrated circuit chips and is suitable for some electronic devices that require high performance and customization. PCB is suitable for most electronic devices, used to connect and support various electronic components, and is the most common circuit carrier in electronic devices. Although IC substrates and PCBs have different functions and application areas, they also have many similarities.

IC Substrate vs PCB

1. Concept

1) IC substrate: In short, IC substrate is a technology that integrates microelectronic components onto circuit boards, widely used in consumer electronics products such as smartphones, tablets, televisions, etc. The IC substrate requires precise wiring to connect various devices according to certain rules, to achieve circuit functions.

2) PCB: PCB, also known as printed circuit board, is a technology that integrates electronic components, connectors, circuit structures, etc. onto the board and is widely used in fields such as computers, communication equipment, and medical devices. PCB requires printing metal wires on the board to achieve the connection and control of electronic components.

2. Design Features

1) Design characteristics of IC substrates: IC substrates usually need to follow precise size standards and wiring rules to meet the requirements of microdevices. During the design process, many challenges need to be faced, such as circuit capacity limitations, heat dissipation issues, noise interference, etc. The design of IC substrates requires the use of 3D modeling and fine animation technology to facilitate circuit simulation and optimization.

2) Design characteristics of PCB: PCB needs to consider issues such as material, process cost, processing technology, and practical application requirements. In the design process, it is necessary to face issues such as electromagnetic compatibility, circuit noise, anti-static, and noise resistance. PCB design requires the use of CAD technology and simulation circuit software to achieve optimization of circuits and processes.

3. Manufacturing process

1) Manufacturing process of IC substrate: The manufacturing of IC substrate requires the use of advanced semiconductor technology, including deposition, exposure, carving, modeling, and other steps. The manufacturing of IC substrates needs to be based on the precision requirements of laser cutting, and production is carried out using prefabricated plates. The production of IC substrates usually adopts batch production or customized production methods.

2) Manufacturing process of PCB: The manufacturing process of PCB includes steps such as printing, drilling, electrostatic dust removal, chemical electroplating, plug-in, testing, packaging, etc. The production of PCB requires the use of high-precision machines and tools, including drilling machines, laser assembly machines, electrostatic eliminators, etc. PCB production usually adopts batch and small-batch production methods to meet various practical needs.

The connection between IC substrate and PCB

Although the application fields and design characteristics of IC substrates and PCBs differ, there are also many connections between them, such as in manufacturing processes, principles, and applications. Both the IC substrates and PCB adopt a modular design concept, which can achieve circuit functionality and optimization through cooperation. There are also many similarities between the equipment and tools used for manufacturing IC substrates and PCBs, such as modeling software, simulation software, and finished product inspection instruments. Both need to follow the same circuit design principles and process standards.

IC substrate and PCB are important components in electronic components, which achieve circuit connection and control through different design characteristics and manufacturing processes.