PCB News - Reasons and solutions of printed circuit board heating

Reasons and solutions ofprinted circuit board heating

The electronic equipment generates heat during operation, which makes the internal temperature of the equipment rise rapidly. The direct reason for the temperature rise of the printed circuit board is the existence of circuit power consumption devices. The electronic devices have power consumption in varying degrees. The heating intensity changes with the power consumption. If the heat is not dissipated in time, the equipment will continue to heat up and the devices will fail due to overheating, The reliability of electronic equipment will decline. Therefore, it is very important to heat the printed circuit board.

PCB Heating

So how to solve the problem of printed circuit board heating? Such problems are generally solved by adding heat dissipation devices or fans to cool the printed circuit board. These external accessories increase the cost and prolong the manufacturing time. Adding fans in the design will also bring unstable factors to the reliability. Therefore, the printed circuit board mainly adopts active rather than passive cooling

There are several ways to heat the printed circuit board for your reference:

1. Heat dissipation through PCB itself.

2. High heating device plus radiator and heat conduction board.

3. Adopt reasonable wiring design to realize heat dissipation.

4. Temperature sensitive devices are best placed in the area with the lowest temperature (such as the bottom of the equipment). Never put them directly above the heating devices. Multiple devices are best staggered on the horizontal plane.

5. The heat dissipation of printed boards in the equipment mainly depends on air flow, so the air flow path should be studied in the design and the devices or printed circuit boards should be configured reasonably.

6. Avoid the concentration of hot spots on the PCB, distribute the power evenly on the PCB as much as possible, and maintain the uniformity and consistency of PCB surface temperature performance.

7. Arrange the device with the highest power consumption and the largest heat generation near the best heat dissipation position.

8. For the equipment cooled by free convection air, it is better to arrange the integrated circuits (or other devices) in a longitudinal manner or in a transverse manner.

9. The devices on the same printed board shall be arranged in zones according to their calorific value and heat dissipation degree as far as possible. The devices with low calorific value or poor heat resistance shall be placed at the top stream (inlet) of the cooling air flow, and the devices with high calorific value or good heat resistance (such as power transistors, large-scale integrated circuits, etc.) shall be placed at the bottom stream of the cooling air flow.

10. In the horizontal direction, high-power devices shall be arranged as close to the edge of the printed board as possible to shorten the heat transfer path; In the vertical direction, high-power devices shall be arranged as close as possible to the top of the printed board, so as to reduce the impact of these devices on the temperature of other devices.

11. When the high heat dissipation device is connected with the substrate, the thermal resistance between them shall be reduced as much as possible. In order to better meet the requirements of thermal characteristics, some thermal conductive materials (such as coating a layer of thermal conductive silica gel) can be used on the bottom of the chip, and a certain contact area can be maintained for heat dissipation of the device.

iPCB.com(PCB Manufacturing) like share this kind article to you.