PCB News - Functions and types of electronic packaging

The four major functions of types electronic packaging are:

1. Provide signal input and output channels for semiconductor chips;
2. Provide a thermal path to dissipate the heat generated by the semiconductor chip;
3. Connect the current path of the semiconductor chip;
4. Provide mechanical support and environmental protection.

Semiconductor microelectronics technology has created unprecedented development foundation and conditions for modern technology, military, national economy and people's daily work and life, and has maintained a good development momentum. The annual output value of the semiconductor industry is generally at a rate of more than 10% year by year. Increment. The semiconductor chip is only a relatively independent individual, and in order to complete its circuit function, it must be connected with other chips and external leads. Due to the development of modern electronic technology, the degree of integration has increased rapidly, and there are more than 1,000 lead wires on a chip. Signal transmission time and signal integrity have become very important issues. The increase in integration has caused a sharp increase in the energy on the chip, and the heat generated on each chip per second is as high as 10J or more. Therefore, how to dissipate heat in time to make the circuit work at normal temperature has become an important issue. It can be seen that the packaging of semiconductor integrated circuits and devices is indispensable to give full play to the functions of semiconductor chips.

PCB types of electronic packaging

It can be said that types electronic packaging directly affects the electrical, thermal, optical and mechanical properties of integrated circuits and devices, as well as their reliability and cost. At the same time, electronic packaging often plays a key role in the miniaturization of the system. Therefore, integrated circuits and devices require electronic packages with excellent electrical, thermal, mechanical, and optical properties, as well as high reliability and low cost. It can be said that whether in military electronic components or in civilian consumer circuits, electronic packaging has a pivotal position, which can be summed up as basic status, leading status and restrictive status.

The more developed integrated circuits, the more important the role of electronic packaging has been demonstrated. Generally speaking, there is a generation of complete machines, there is a generation of circuits and a generation of electronic packaging. To develop microelectronics technology and to develop large-scale integrated circuits, three key issues must be solved: chip design, chip manufacturing and processing technology and packaging. The three are indispensable and must be developed in a coordinated manner.

Electronic materials are the foundation for the development of the microelectronics industry. As the main structural material for the production of integrated circuits, epoxy molding compounds are also developing rapidly with the development of chip technology, and the development of molding materials technology will greatly promote the development of the microelectronics industry. At present, integrated circuits are developing towards high integration, miniaturization of wiring, large-scale chips and surface mounting technology. The research and development trend of plastic packaging materials corresponding to this is to make materials with high purity, low stress, low expansion, low radiation and high radiation. Performance characteristics such as heat resistance. .

ipcb can provide you with high-quality SMT patch processing services, as well as rich experience in PCBA processing. PCBA types of electronic packaging labor and materials will relieve your worries. ipcb can also undertake PCB fabrication and electronic circuit board manufacturing services.