PCB News - Evaluation standards for the quality of pcb circuit boards (below)

Evaluation standards for the quality of (below)
Pay attention to product innovation in terms of energy saving and emission reduction. PCB factoriesmust learn to attach importance to Internet technology and realize the practical application of automated monitoring and intelligent management in production through the integration of overall industry knowledge.
Paying attention to the trend of environmental protection informatization and the development of various environmental protection technologies, PCB factories can start with big data to monitor the company's pollution discharge and governance results, and find and solve environmental pollution problems in a timely manner. Keep up with the production concept of the new era, continuously improve resource utilization, and realize green production. Efforts to enable the PCB factory industry to achieve an efficient, economical and environmentally friendly production model, and actively respond to the country's environmental protection policy.
4. The tolerance of the copper clad laminate meets the requirements of IPC4101ClassB/L
Benefits: Strict control of the thickness of the dielectric layer can reduce the deviation of expected electrical performance.
The risk of not doing so
The electrical performance may not meet the specified requirements, and the output/performance of the same batch of components will be quite different.
5. Define solder mask materials to ensure compliance with IPC-SM-840ClassT requirements
Benefits: "Excellent" ink, to achieve ink safety, to ensure that the solder mask ink meets UL standards.
The risk of not doing so

Inferior inks can cause adhesion, flux resistance, and hardness problems. All these problems will cause the solder mask to separate from the circuit board and eventually lead to corrosion of the copper circuit. Poor insulation properties can cause short circuits due to accidental electrical continuity/arc.
6. Defining the tolerances of shapes, holes and other mechanical features
Benefits: Strict control of tolerances can improve the dimensional quality of products-improve fit, shape and function
The risk of not doing so
Problems in the assembly process, such as alignment/fitting (only when the assembly is completed will the press-fit needle problem be discovered). In addition, due to the increased size deviation, there will be problems when installing the base.
7. Requirements for the thickness of the solder mask, although IPC does not have relevant regulations
Benefits: Improve electrical insulation properties, reduce the risk of peeling or loss of adhesion, and strengthen the ability to resist mechanical impact-no matter where the mechanical impact occurs!
The risk of not doing so
Thin solder mask can cause adhesion, flux resistance and hardness problems. All of these problems will cause the solder mask to separate from the circuit board, and eventually lead to corrosion of the copper circuit. The thin solder mask causes poor insulation properties and can cause short circuits due to accidental conduction/arc. iPCB has passed ISO9001:2008, ISO14001, UL, CQC and other quality management system certifications, and produces standardized and qualified PCB products. We master complex process skills and use professional equipment such as AOI and Flying Probe to control production, X-ray inspection machines, etc. . Finally, we will use double FQC inspection of appearance to ensure shipment under IPC II standard or IPC III standard.