Precision PCB Fabrication, High-Frequency PCB, High-Speed PCB, Standard PCB, Multilayer PCB and PCB Assembly.
The most reliable PCB & PCBA custom service factory.
PCB News

PCB News - PCB component library naming rules

PCB News

PCB News - PCB component library naming rules

PCB component library naming rules

2021-11-03
View:489
Author:Kavie
  1. Integrated circuit (in-line)
    Use DIP-pin number + suffix to indicate dual in-line package
    There are two suffixes, N and W, to indicate the body width of the device
    N is a narrow package with a body width of 300mil and a pin pitch of 2.54mm
    W is the package with body width, the body width is 600mil, and the pin pitch is 2.54mm
    For example: DIP-16N represents a 16-pin narrow dual-in-line package with a body width of 300mil and a pin pitch of 2.54mm

PCB

2. Integrated PCB circuit (SMD)
Use SO-pin number + suffix to indicate small outline SMD package
There are three suffixes of N, M and W to indicate the body width of the device
N is a narrow package with a body width of 150mil and a pin pitch of 1.27mm
M is a package between N and W, with a body width of 208mil and a pin pitch of 1.27mm
W is the package with body width, the body width is 300mil, and the pin pitch is 1.27mm
For example: SO-16N represents a 16-pin small-outline chip package with a body width of 150mil and a pin pitch of 1.27mm
If SO is preceded by M, it means that it is a micro package with a body width of 118mil and a pin pitch of 0.65mm

3. Resistance
3.1 The naming method for SMD chip resistors is: package + R
Such as: 1812R represents a resistor package with a package size of 1812
3.2 The naming method for carbon film resistors is: R-package
For example: R-AXIAL0.6 represents a resistor package with a pad pitch of 0.6 inches
3.3 The naming method of cement resistance is: R-model
Such as: R-SQP5W represents a cement resistor package with a power of 5W

4. Capacitance
4.1 The naming method for non-polar capacitors and tantalum capacitors is: package + C
Such as: 6032C means that the package is 6032 capacitor package
4.2 The naming method of SMT monolithic capacitors is: RAD + pin spacing
For example: RAD0.2 means SMT monolithic capacitor package with a pin pitch of 200mil
4.3 The naming method of electrolytic capacitors is: RB+pin spacing/outer diameter
For example: RB.2/.4 means an electrolytic capacitor package with a pin pitch of 200mil and an outer diameter of 400mil

5. Diode rectifier device
The naming method is based on the actual package of the component, where BAT54 and 1N4148 are packaged as 1N4148

6. Transistor
The naming method is based on the actual package of the component. Q is added to the SOT-23Q package to distinguish the SOT-23 package of the integrated circuit. The other FETs use the component name as the package name in order to call the component without making mistakes.

7, crystal oscillator
HC-49S, HC-49U are surface mount packages, AT26, AT38 are cylindrical packages, and the size of the digital meter
For example: AT26 represents a cylindrical package with an outer diameter of 2mm and a length of 8mm

8. Inductance and transformer parts
Inductive sealing package adopts TDK company package

9. Optoelectronic devices
9.1 The naming method of SMD LED is package + D to indicate
Such as: 0805D means light-emitting diode packaged as 0805
9.2 In-line light-emitting diodes are expressed as LED-outer diameter
For example, LED-5 represents a direct plug-in light-emitting diode with an outer diameter of 5mm
9.3 The nixie tube uses the device's own name naming

10. Plug
10.1 SIP + number of pins + pin spacing to indicate a single row of pins, there are two types of pin spacing: 2mm, 2.54mm
For example: SIP7-2.54 means a 7-pin single row pin with a pin pitch of 2.54mm
10.2 DIP + number of pins + pin spacing to indicate double row of pins, there are two types of pin spacing: 2mm, 2.54mm
For example: DIP10-2.54 means 10-pin double row pins with a pin pitch of 2.54mm

The above is an introduction to the naming rules of PCB component libraries. Ipcb is also provided to PCB manufacturers and PCB manufacturing technology.