PCB News - What are the process materials used in the smt factory to process patches?

What are the process materials used in the smt factory to process patches?
The Internet era has broken the traditional marketing model, and a large number of resources have been gathered together to the greatest extent through the Internet, which has also accelerated the development speed of FPC flexible circuit boards, and then as the development speed accelerates, environmental problems will continue to appear in PCB factories. In front of him. However, with the development of the Internet, environmental protection and environmental informatization have also been developed by leaps and bounds. Environmental information data centers and green electronic procurement are gradually being applied to the actual production and operation fields. From this point of view, the environmental protection problems of PCB factories can be solved from the following two points.

In the smt factory, SMT process materials play a vital role in the quality and production efficiency of SMT patch processing, and are one of the foundations of SMT patch processing. When designing the SMT process and establishing the production line, appropriate process materials must be selected according to the process flow and process requirements.

SMT process materials include solder, solder paste, adhesives and other welding and patch materials, as well as flux, cleaning agents, heat transfer media and other process materials. The main functions of the assembly process materials are as follows:

(1) Solder and solder paste

Solder is an important structural material in the surface assembly process. Different types of solder are used in different applications, which are used to connect the metal surface of the welded object and form a solder joint. Reflow soldering uses solder paste, which is a soldering material, and at the same time can use its viscosity to pre-fix the SMC/SMD.

(2) Flux

Flux is an important process material in surface assembly. It is one of the key factors that affect the quality of welding. It is needed in various welding processes, and its main function is to assist welding.

(3) Adhesive

Adhesive is the bonding material in surface assembly. When using the wave soldering process, an adhesive is generally used to pre-fix the components on the PCB. When assembling SMD on both sides of the PCB, even if reflow soldering is used, adhesive is often applied to the center of the PCB land pattern to strengthen the fixation of the SMD and prevent the SMD from shifting and falling during the assembly operation.

(4) Cleaning agent

The cleaning agent is used in surface assembly to clean the residue left on the SMA after the soldering process. Under current technical conditions, cleaning is still an indispensable part of the surface mount process, and solvent cleaning is the most effective cleaning method.
In the smt factory, the SMT process material is the basis of the surface mount process, and the corresponding assembly process materials are selected for different assembly processes and assembly procedures. Sometimes in the same assembly process, the materials used are also different due to different subsequent processes or different assembly methods. You can order as little as 1 PCB from us. We will not force you to buy things you really don't need to save money.
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