PCB News - How to choose pcba processing components and substrates?

How to choose PCBA processing components and substrates?
The PCBA processing includes four parts: PCB circuit boardmanufacturing, PCB proofing and patching, smt patch processing, and electronic component procurement. The following PCBA processing factory will share how to choose PCBA processing components and substrates.

How to choose PCBA processing components and substrates?

Before 2015, the model was that the customer went to the PCB board factory for proofing and the electronic component supplier to buy the device, and then sent the two items together to the smt processing factory for production. Since 2017, there have been many companies in China that have integrated the above three items, and the companies that can integrate the above are called PCBA manufacturers.

So since it involves all outsourcing to SMT placement factories, we also need to know how suppliers choose electronic components and PCB boards during processing, and what are the standards. Today we will share the knowledge of PCB processing components and substrate selection:

1. Selection of electronic components

The selection of electronic components should fully consider the actual total area of the SMB, and use conventional electronic components as much as possible. Do not blindly pursue small-size electronic components to prevent increased costs. IC devices should pay attention to the pin shape and pin spacing. QFPs with a pin spacing of less than 0.5mm should be carefully considered. It is better to directly choose BGA packaged devices. In addition, the packaging form of electronic components, terminal electrode size, PCB solderability, reliability of smt devices, and temperature tolerance (such as whether it can meet the needs of lead-free soldering) should be considered.

After selecting electronic components, a database of electronic components must be established, including relevant information such as installation dimensions, pin dimensions, and SMT manufacturers.

Second, the selection of plates

The substrate should be selected according to the use conditions of the SMB and the characteristics of mechanical and electrical equipment; the number of copper-clad surfaces of the substrate (single-sided, double-sided or multi-layer SMB) is determined according to the SMB structure; according to the size of the SMB and the total unit area Carry the quality of electronic components and determine the thickness of the substrate board. The cost of different types of materials varies greatly. When selecting SMB substrates, consideration should be given to the characteristics of electrical equipment, Tg (glass transition temperature), CTE, flatness and other factors, as well as hole metallization capabilities, price and other factors.

Well, this is the knowledge about how to choose PCB processing components and substrates. It is also a simple review of the inside story of the PCBA processing factory. I hope to have some help to all friends, thank you.
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