Precision PCB Fabrication, High-Frequency PCB, High-Speed PCB, Standard PCB, Multilayer PCB and PCB Assembly.
The most reliable PCB & PCBA custom service factory.
Single-sided circuit board, double-sided tin-sprayed board, double-sided nickel-plated gold, multi-layer tin-sprayed board, multilayer nickel-plated gold, multilayer nickel-plated board. Make a detailed introduction to these kinds of circuit board processing processes.
1. Single-panel process flow: blanking and edging - drilling - outer layer graphics - (full board gold plating) - etching - inspection - silk screen solder mask - (hot air leveling) - silk screen characters - shape processing - test - inspection.
2. The process flow of the double-sided tin spray board is blanking and edge grinding - drilling - heavy copper thickening - outer layer graphics - tin plating, etching tin removal - secondary drilling - inspection - silk screen solder mask - gold-plated plug - hot air leveling -Silk screen characters-Shape processing-Test-Inspection.
3. The double-sided nickel-plated gold process flow: blanking and edge grinding - drilling - heavy copper thickening - outer layer graphics - nickel plating, gold removal and etching - secondary drilling - inspection - silk screen solder mask - silk screen characters - shape processing -Test -Inspect.
4. The process flow of multi-layer board tin spraying board blanking and grinding - drilling positioning holes - inner layer graphics - inner layer etching - inspection - blackening - lamination - drilling - heavy copper thickening - outer layer graphics - tin plating, Etching tin removal-secondary drilling-inspection-screen printing solder mask-gold-plated plug-hot air leveling-screen printing characters-shape processing-test-inspection.
5. The process flow of nickel and gold plating on multilayer boards is blanking and grinding - drilling positioning holes - inner layer graphics - inner layer etching - inspection - blackening - lamination - drilling - sinking copper thickening - outer layer graphics - gold plating, removing Film etching-secondary drilling-inspection-screen printing solder mask-screen printing characters-shape processing-test-inspection.
6. Process flow of multi-layered nickel-gold plate: cutting edge grinding - drilling positioning hole - inner layer pattern - inner layer etching - inspection - blackening - lamination - drilling - sinking copper thickening - outer layer pattern - tinning, Etching tin removal-secondary drilling-inspection-screen printing solder mask-electroless nickel gold-screen printing characters-shape processing-test-inspection.
The above is an introduction to the circuit board processing technology. Ipcb also provides PCB manufacturers and PCB manufacturing technology.
