PCB News - What is a high frequency board

What is a high frequency board

The high frequency of electronic equipment is a development trend, especially in wireless networks and satellite communications, information products are often very high. High-frequency board products use high-frequency, high-frequency, high-frequency communication, high-speed wireless transmission standardization, video and data. The new generation of products requires high-frequency substrates, including satellite communication systems, base stations for receiving mobile phones, and so on.

In the next few years, this sector will inevitably be developed, and high-frequency substrates will be required to a large extent.

2. The basic characteristics of high-frequency base materials are as follows:

(1) The dielectric constant (DK) must be small and stable. Generally speaking, the higher the signal transmission rate and the dielectric constant of the material. The square root is proportional, and a high dielectric constant can easily cause signal delay.

(2) The dielectric loss (DF) must be low, which mainly affects the quality of signal transmission. The less the dielectric loss, the less the signal loss.

(3) The thermal expansion coefficient of copper foil is the same as that of copper foil, because the inconsistency will cause the copper foil to separate in the change of cold and heat.

(4) Low water absorption and high water absorption will affect the dielectric constant and dielectric loss.

(5) Other heat resistance, chemical, impact and pipeline resistance are also very good. Generally speaking, high frequencies can be defined as frequencies above 1 GHz. At present, the most commonly used high-frequency circuit board substrate is fluorinated fluid.

Substrates such as polytetrafluoroethylene (PTFE) are commonly referred to as telescopes and are usually used above 5 GHz, and can be used for FR-4 or pp-4 substrates including products from 1 GHz to 10 GHz. The comparison is as follows.

Epoxy resins, PPO resins and fluorinated resins are currently three high-frequency substrate materials prepared with epoxy resins.

Fluorinated resin is the cheapest, while fluorinated resin is the most expensive; when the product application frequency exceeds 10 GHz, only fluorinated resin can be used. The performance of high-frequency fluorine resin substrate is much higher than other substrates. But its spread is very poor.

For the high temperature expansion coefficient (PTFE) of polytetrafluoroethylene (PTFE), a large number of inorganic materials (such as SIO 2) or glass fabrics are used to enhance the properties of PTFE, thereby increasing additional rigidity.

In the molecular inertia of PTFE resin, it is difficult to add copper foil, so special surface treatment for the interface with copper foil is required.

Plasma etching on the PTFE surface increases the surface roughness, or adds an adhesive layer between the copper foil and the PTFE resin to enhance adhesion, but it may affect the development of the entire system frequency circuit of the system.

First, a research unit, a device, a printed circuit board manufacturer and a communication system. Product manufacturers and other partners cooperate to monitor the rapid development of high-frequency circuits in this area.

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