PCB News - Sleeton applies the latest ceramic circuit board cutting scribing and drilling system

Sleeton applies the latest ceramic circuit board cutting scribing and drilling system

Our company is a high-tech enterprise specializing in the research and development, production and sales of planar and three-dimensional inorganic non-metal-based electronic circuits and electronic components. It owns the brand of Siliton ceramic circuit boards.
The company’s main products are ceramic-based circuit boards, such as alumina ceramics, aluminum nitride ceramics, zirconia ceramics, glass, quartz, etc., which are made by laser rapid activation metallization technology.

The bonding strength between the metal layer and the ceramic is high, the electrical performance is good, and it can be welded repeatedly. The thickness of the metal layer can be adjusted within 1μm-1mm. The L/S resolution can reach 20μm. It can directly realize the via connection and provide customers with customization. s solution.
The product has obtained a number of invention patents in the process of research and development and production, and the related technology has completely independent intellectual property rights. The current annual production capacity of the first phase is 12,000 square meters.
The company has a professional production, technology research and development team, advanced marketing management system and high-quality software and hardware facilities. The systematic decision-making process and rigorous warehouse management system provide guarantee for the efficiency of our production capacity. We are committed to providing the most professional, fastest, and most intimate customized services to global customers.
The latest system introduction:
Applicable materials: aluminum oxide, aluminum nitride, zirconium oxide, beryllium oxide, silicon nitride, silicon carbide and all metal materials below 3mm thickness.
Applicable industries: High-grade ceramic substrate PCB circuit contour cutting, through-hole, blind hole drilling, LED ceramic substrate drilling and cutting; high temperature and wear-resistant automotive electrical circuit boards, precision ceramic gears and appearance components cutting, and precision metal gears and structural parts Cutting and drilling.
Laser processing principle: Laser cutting ceramics or drilling uses a 200-500W continuous fiber laser through optical shaping and focusing, so that the laser forms a high-energy density laser beam with a line width of only 40um at the focal point, and the instantaneous peak power is as high as tens of kilowatts., Locally irradiate the surface of the ceramic substrate or metal sheet, so that the surface of the ceramic or metal material is quickly vaporized and peeled off in a very short time, thereby forming the material removal to achieve the purpose of cutting and drilling.
Model features: The ceramic substrate micro-cutting and drilling system adopts self-developed strong smart®, multi-axis laser control software, powerful software functions can be imported into DXF, DWG, PLT and other formats, and the software can realize 1., laser energy real-time Instant adjustment and control, X, Y linear motor precision motion platform, precision motion and grating ruler real-time detection and compensation, 2., laser cutting head Z axis follow-up dynamic focusing automatic compensation and blowing cooling function, 3., CCD vision automatic positioning function, It is convenient for the positioning of product dimensions during precision cutting. The effective stroke is 600*600mm, the repeatability is ±1um, the positioning accuracy is ±3um, and the high-precision dedicated vacuum suction table is equipped with 200-500W fiber laser or CO2 laser. The Z-axis effective stroke is 150mm, and the thickness is less than 3mm. PCB ceramic substrate or thin metal sheet for cutting and drilling, the smallest hole diameter can reach 80um.