PCB News - Understand what a high-density printed circuit board (HDI circuit board) is

Understand what a high-density printed circuit board (HDI circuit board) is

The printed circuit board (HDI circuit board) is a layout element composed of insulating materials and conductor wiring.

When the final product is made, integrated circuits, transistors, diodes, passive components (such as resistors, capacitors, connectors, etc.) and other various electronic components will be installed on it. Through the wire connection, the electronic signal can be maintained and the performance can be formed.

Therefore, the printed circuit board is a platform for holding the supply components to accept the base of the contact parts.

Because the printed circuit board is not an ordinary end product, the definition of the title is a little messy, for example: the motherboard used in personal computers is called the motherboard and cannot be indirectly called the circuit board, although there are circuits in the motherboard The existence of boards is not the same, so when evaluating property, the two are related but cannot be said to be the same.

Another example: because there are integrated circuit parts mounted on the circuit board, the news media call it an IC board, but it is not the same as a printed circuit board in nature.

Under the precondition that electronic products tend to become more multifunctional, the contact spacing of integrated circuit components has been reduced, and the signal transmission rate has increased relatively, followed by the increase in the number of wiring and the wiring between points. Partially shrinking of the length, these require the use of high-density circuit installation equipment and micro-hole technology to achieve the goal.

Wiring and jumper are fundamentally difficult for single and double panels. Therefore, the circuit board will be multi-layered. Because of the inexhaustible increase of signal lines, more power and ground layers are necessary for the imagination. At the wrist, these have prompted the Multilayer Printed Circuit Board (Multilayer Printed Circuit Board) to be more widely available.

For the electrical requirements of high-speed signals, the circuit board must provide impedance control with switching electrical characteristics, high-frequency transmission capabilities, and low unnecessary radiation (EMI).

With the layout of Stripline and Microstrip, multi-layering has become a necessary idea.

In order to reduce the quality of signal transmission, insulating materials with low dielectric coefficient and low attenuation rate will be adopted to miniaturize and array common electronic components, and the density of circuit boards will continue to increase to meet demand.

The appearance of BGA (Ball Grid Array), CSP (Chip Scale Package), DCA (Direct Chip Attachment) and other component assembly methods has promoted the advancement of printed circuit boards to an unprecedented high-density situation.

Any hole with a diameter of less than 150um is called a microvia in the industry. The circuit made by manipulating the number of layout techniques of this type of microvia can improve the efficiency of assembly, space manipulation, etc., and also have the miniaturization of electronic products. It needs sex.

For circuit board products of this type of layout, the industry has had too many different titles to name such a circuit board.

For example, because the European and American companies used a sequential construction method for their construction, they called this type of product SBU (Sequence Build Up Process), which is generally translated as "Sequence Build Up Process."

As for the Japanese industry, because the hole layout of these products is much smaller than the previous holes, the construction technology of these products is called MVP (Micro Via Process), which is generally translated as "Micro Via Process." .

Some people are called MLB (Multilayer Board) because of the traditional multi-layer board, so the title of this type of circuit board is BUM (Build Up Multilayer Board), which is generally translated as "build-up multi-layer board".

The IPC Circuit Board Association of the United States puts forward the general name of HDI (High Density Intrerconnection Technology) to prevent mixing, and if it is indirectly translated, it will become a high-density retention technology.

However, this cannot reflect the characteristics of the circuit board, so most of the circuit board manufacturers call this type of product HDI board or the full Chinese title "High-Density Interconnection Technology". However, due to the smoothness of the vernacular, some people indirectly refer to such products as "high-density circuit boards" or HDI circuit boards.