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HDI is an abbreviation for High Density Interconnect Circuit Board. It is a circuit board that uses micro-blind hole technology to produce printed circuit boards (technology).
HDI is a compact product designed for small-capacity users. Adopting modular parallel design, one module has a capacity of 1000 VA (1U height), natural cooling, can be directly placed in a 19-inch rack, and up to 6 modules can be connected in parallel.
The product adopts all-digital signal processing and control (DSP) technology and a variety of patented technologies, has full-range adaptability and strong short-term overload capability, and cannot consider load power factor and crest factor.
HDI is the abbreviation for High Density Interconnector.
It is a circuit board that uses micro-blind hole technology to produce printed circuit boards (technology). HDI is a compact product designed for small-capacity users. Adopting modular parallel design, one module has a capacity of 1000 VA (1U height), natural cooling, can be directly placed in a 19-inch rack, and up to 6 modules can be connected in parallel.
The product adopts all-digital signal processing and control (DSP) technology and a variety of patented technologies, has full-range adaptability and strong short-term overload capability, and cannot consider load power factor and crest factor.
The electronic design not only improves the performance of the whole machine, but also tries to reduce its size. From mobile phones to smart weapons, in small portable products, "small" has never been a pursuit. High-density integration (HDI) technology can make the final product design more compact, while meeting higher electronic performance and efficiency standards.
HDI is widely used in digital products such as mobile phones, digital cameras, MP3, MP4, notebook computers, and automotive electronics, among which mobile phones are the most widely used.
HDI boards are generally manufactured by the layering method (photographed). The more layers, the higher the technical level of the board. The ordinary HDI board is basically a main layer. High-order HDI adopts two or more stacking processes, using advanced PCB technology, such as stacking holes, electroplating filled holes, laser direct drilling, etc.
Advanced HDI boards are mainly used in 3G mobile phones, advanced digital cameras, IC boards, etc.
Development prospects: According to the use of high-end HDI boards-3G boards or IC boards, its future development is very rapid: In the next few years, 5G mobile phones will grow by more than 30% worldwide, and China will soon issue 5G licenses ;
From 2005 to 2010, China's economic growth rate will reach 80%, which represents the direction of PCB technology development.
Advantages of HDI circuit The cost of PCB can be reduced: when the density of the PCB increases by more than 8 layers, the cost of HDI will be lower than the cost of the traditional complex compaction process.
Increase circuit density: the interconnection between traditional circuit boards and components This facilitates the use of advanced building technologies.
Better electrical performance and signal accuracy. Better reliability. It can improve thermal performance.
Improved radio frequency interference/electromagnetic interference/electrostatic discharge (RFI/EMI/ESD) improves design efficiency.
iPCB is a high-tech manufacturing enterprise focusing on the development and production of high-precision PCBs. iPCB is happy to be your business partner. Our business goal is to become the most professional prototyping PCB manufacturer in the world. Mainly focus on microwave high frequency PCB, high frequency mixed pressure, ultra-high multi-layer IC testing, from 1+ to 6+ HDI, Anylayer HDI, IC Substrate, IC test board, rigid flexible PCB, ordinary multi-layer FR4 PCB, etc. Products are widely used in industry 4.0, communications, industrial control, digital, power, computers, automobiles, medical, aerospace, instrumentation, Internet of Things and other fields.
