PCB News - Commonly used phrases on PCB board

Commonly used phrases on PCB board

Commonly used phrases for PCB board: 1. A-STAGE A stage

In the manufacturing process of the film (PREPREG), when the glass cloth or cotton paper of the reinforcing material is impregnated through the glue tank, the resin glue (Varnish, also translated as varnish water) is still in a monomer and is The state of solvent dilution is called A-Stage. In contrast, when the glass woven cloth or tissue paper absorbs glue and is dried by hot air and infrared rays, the molecular weight of the resin will increase to a complex or oligomer (Oligomer), and then It is assembled on the reinforcing material to form a film. The state of the resin at this time is called B-Stage. When it continues to be heated to soften and further polymerizes to become the final polymer resin, it is called C-Stage

2.Addition agent additives----

Process additives that improve product properties, such as gloss or leveling agents required for electroplating.

3.Adhesion adhesion----

refers to the adhesion strength of the surface layer to the main body, such as green paint on the copper surface, or copper skin on the surface of the substrate, or the adhesion between the plating layer and the substrate.

4.Annular ring hole ring----

Refers to the copper ring that is wrapped around the through hole and is flat on the board. The ring on the inner board is often connected to the outer ground by a cross bridge, and is more often used as the end of the line or a passing station. On the outer board. In addition to being used as a crossing station of the line, the upper can also be used as a solder pad for the pin soldering of the parts. There are also pad (matching circle), land (independent point), etc. which are synonymous with this word.

5.Artwork Negative Film---

In the circuit board industry, this word often refers to black and white negatives. As for the brown "Diazo Film" (Diazo Film), it is also called phototool. The negatives used by PCBs can be divided into "original negatives" Master Artwork And the "working negative" working Artwork after reprinting the photo, etc.

6.Back-up pad

It is a gasket that is placed under the circuit board when drilling and is in direct contact with the machine table surface, which can prevent the drill needle from hurting the table surface, reduce the temperature of the drill needle, remove the waste in the chip removal groove, and reduce the appearance of hair on the copper surface. Function. Generally, the backing board can be made of phenolic resin board or wooden paddle board as raw material.

7. Binder adhesive

Adhesive resin part in various laminates, or dry film resists, adhesives and forming agents that are added to "mold" without being too "scattered".

8.Black oxide black oxide layer

In order for the multilayer board to maintain the strongest fixing force after being laminated, the copper conductor surface of the inner board must first be coated with a black oxide treatment layer. At present, this roughening treatment is also suitable for different If needed, the improvement is Brown Oxide or reddish treatment, or brassy treatment.

9. Blind Via Hole

Refers to a complex multi-layer board, because some of the vias only need a certain layer of interconnection, so they are deliberately incompletely drilled. If one of the holes is connected to the ring of the outer board, this is like a cup. The special hole in the dead end is called "Blind Hole" (Blind Hole).

10.Bond strength

refers to the force applied per unit area (LB/IN2) when trying to forcefully separate adjacent layers in a reverse manner (not torn apart) in a laminated board.

11.Buried Via Hole

refers to the local vias of the multilayer board. When it is buried in the "inner vias" between the layers of the multilayer board and is not "connected" with the outer board, it is called buried vias or buried vias for short.

12.Burning

refers to the area where the current density of the coating is too high, and the coating has lost its metallic luster and presents a grayish powdery situation.

13.Card board

is an informal name for a circuit board, which often refers to a long, narrow or smaller board with peripheral functions, such as adapter cards, memory cards, IC cards, Smart cards, etc.

14.Catalyzing

"Catalysis" is an additional "introducer" added to each reactant before a general chemical reaction, so that the required reaction can be carried out smoothly. In the circuit board industry, it refers specifically to the PTH process, its "palladium chloride The "activation catalysis" of the bath liquid on the non-conductor plate first bury the growing seeds for the electroless copper coating, but this academic term is now more colloquially referred to as "activation" or "nucleation" ( Nucleating) or "下种" (Seeding). There is another Catalyst, which is correctly translated as "catalyst".

15.Chamfer chamfer

In the gold finger area of the board edge of the circuit board, in order to facilitate the insertion of continuous contacts, not only the bevelling work must be completed at the front edge of the board edge, but also the board corner or direction slot (slot) The right angles of the mouth are also removed, which is called "chamfer". It also refers to the chamfer between the end of the shank of the drill bit and the shank.

16.Chip dies, chips, flakes

In the heart of various integrated circuit (IC) packages, there are densely-circuited dies or chips (CHIP). This kind of small "circuit chip" is a collection of wafers (Wafer). ) Cut from above.

17.Component Side

In the early days when the circuit board was fully plugged in through holes, the parts must be installed on the front of the board, so the front side was also called the "component side"; the back side of the board was only used for the solder wave to pass through, so it was also called It is the "Soldering Side" (Soldering Side). At present, both sides of the SMT board have to be bonded with parts, so there is no longer a "component side" or "solder side". It can only be called the front side or the back side. Usually the front side is printed The name of the manufacturer of the electronic machine, and the UL code and production date of the circuit board manufacturer can be added on the reverse side of the board.

18.Conditioning the whole hole

This word broadly refers to its own "adjustment" or "adjustment", so that it can adapt to the later situation. In a narrow sense, it refers to the dry plate and hole wall before entering the PTH process to make it "hydrophilic" and "adapted". "Positiveness", and the cleaning work is completed at the same time, in order to continue other subsequent various treatments. Before this through-hole process is launched, the action of arranging the hole wall is called Hole conditioning.

19.Dent depression

refers to the gentle and uniform sag on the copper surface, which may be caused by the partial protrusion of the steel plate used for pressing.If it shows a neat drop of the faulty edge, it is called Dish Down.

20. Desmearing

It refers to the high friction and heat of the circuit board in the drilling. When the temperature exceeds the Tg of the resin, the resin will soften or even form a fluid and coat the hole wall with the rotation of the drill bit. There is a barrier between the hole ring and the copper hole wall made later. Therefore, at the beginning of the PTH, various methods should be used to remove the formed slag, so as to achieve the purpose of subsequent good connection (Connection).

21.Diazo Film

It is a kind of negative film with brown light-blocking film. It is a special exposure tool (PHOTOTOOL) in ultraviolet light when the dry film image is transferred. This kind of azo brown film can be in the "visible light" even in the brown shading area. It is much more convenient to see through the bottom of the film than with black and white film.

22.Dielectric medium

It is the abbreviation of "dielectric substance". It originally refers to the insulation between the two plates of the capacitor. Now it generally refers to the insulation between any two conductors, such as various resins and matched tissue paper, and glass woven cloth, etc. All belong to it.

23.Diffusion Layer

is another term for the extremely thin "Cathod film" (Cathod film) formed on the cathode surface of the plated parts in the liquid during electroplating.

24.Dimensional Stability

Refers to the amount of change in the length, width, and flatness of the board under the influence of temperature changes, humidity, chemical treatment, aging or applied pressure, and it is generally expressed as a percentage. At this time, the vertical highest point of the PCB board surface from the reference plane (such as a marble platform) is subtracted from the board thickness, which is the vertical deformation, or directly use the steel needle of the aperture to measure the height of the board. The amount of deformation is used as the numerator, and the length of the board or the diagonal length is used as the parent component, and the obtained percentage is the characterization of the stability of the scale, commonly known as "size stability".

25. Drum Side Copper Foil Glossy

The electroplated copper foil is made by plating copper foil on the smooth "titanium carcass" of the stainless steel cathode wheel (Drum) at a high current density (about 1000ASF) in a copper sulfate solution. The rough surface of the liquid and the smooth surface of the carcass close to the wheel, the latter is called "Drum Side".

26.Dry Film

It is a dry sexy photo film resist used for circuit board image transfer, and there are two layers of PE and PET film for sandwich protection. The isolation layer of PE can be torn off during on-site construction to allow the photoresist film in the middle Pressed on the copper surface of the board, after the film is exposed to light, the PET surface protective film can be removed, and the local resist of the circuit pattern can be formed by washing and developing, and then etching (inner layer) or electroplating ( Outer layer) process, and finally after copper etching and stripping, the board surface with bare copper circuit is obtained.

27. Electrodeposition plating

Direct current is applied to the electroplating solution containing metal ions, so that the metal can be plated on the cathode. This word has a synonymous word Electroplating, or simply called plating. More formally, it is electrol ytic plating. It is a kind of experience. Yu Xueli's processing technology.

28. Elongation

often refers to the part of the metal that will grow under tension (tension) until it stretches before the fracture occurs, which is the percentage of the original length, which is called extensibility.

29.Entry Material cover

When drilling the circuit board, in order to prevent the pressure foot on the drill shaft from causing indentation on the board surface, an additional aluminum cover plate is required on the copper foil substrate. This type of cover plate also reduces the swing and slip of the drill pin. Reduce the heating of the drill bit and reduce the generation of hair.

30. Epoxy Resin epoxy resin

It is a very versatile THERMOSETTING high molecular polymer, generally used for molding, packaging, coating, adhesion and other purposes. In the circuit board industry, it is the most consumed insulation and bonding purpose The resin can be compounded with glass woven cloth, glass woven mat, and white kraft paper to form a board, and can contain various additives to achieve the purpose of flame retardancy and high functionality, as the base material for all levels of circuit boards.