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PCB News - Thick copper circuit board, high frequency circuit board, Shenzhen circuit board

PCB News

PCB News - Thick copper circuit board, high frequency circuit board, Shenzhen circuit board

Thick copper circuit board, high frequency circuit board, Shenzhen circuit board

2021-09-18
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Author:Aure

Thick copper circuit board, high frequency circuit board, Shenzhen circuit board


Fourteen important features of PCB, PCB circuit boards are almost the same on the surface regardless of their internal quality.

It is through the surface that we see the differences, and these differences are critical to the durability and functionality of the PCB circuit board throughout its life.

Whether in the PCB manufacturing assembly process or in actual use, the PCB circuit board must have reliable performance, which is extremely important.

In addition to related costs, defects in the assembly process may be brought into the final product by the PCB circuit board, and failures may occur during actual use, leading to claims.

Therefore, from this point of view, it is no exaggeration to say that the cost of a high-quality PCB circuit board is negligible.

In all market segments, especially those that produce products in key application areas, the consequences of such failures are disastrous.

These aspects should be kept in mind when comparing PCB prices. Although the initial cost of a reliable, guaranteed, and long-life product is high, it is still worth the money in the long run.



Thick copper circuit board, high frequency circuit board, Shenzhen circuit board

Let's take a look at the 14 most important features of high-reliability PCB circuit boards:

1. The copper thickness of the hole wall of 25 microns. Benefits: Enhance reliability, including improving the expansion resistance of the z-axis.

Risks of not doing so: blow holes or outgassing, electrical connectivity problems during assembly (inner layer separation, hole wall breakage), or failure under load conditions during actual use. IPCClass2 (the standard adopted by most factories) requires 20% less copper plating.

2. No welding repair or open circuit repair. Benefits: A perfect circuit can ensure reliability and safety, no maintenance and no risk.

The risk of not doing this: If the repair is not done properly, it will cause the circuit board to open. Even if the repair is ‘proper’, there is a risk of failure under load conditions (vibration, etc.), which may cause failure in actual use.

3. Exceeding the cleanliness requirements of IPC specifications. Benefits: Improve PCB cleanliness to improve reliability.

Risks of not doing so: Residues and solder accumulation on the circuit board bring risks to the solder mask. Ionic residues can cause corrosion and contamination risks on the soldering surface, which may lead to reliability problems (bad solder joints/electrical failures), and Eventually increase the probability of actual failure.

4. Use internationally well-known substrates-do not use "local" or unknown brands Benefits: improve reliability and known performance

Risks of not doing so: Poor mechanical performance means that the circuit board cannot perform the expected performance under assembly conditions, for example: high expansion performance will cause delamination, open circuit and warpage problems. Weakened electrical characteristics can lead to poor impedance performance.

5. Strictly control the service life of each surface treatment. Benefits: solderability, reliability, and reduce the risk of moisture intrusion

The risk of not doing this: due to the metallographic changes in the surface treatment of the old circuit boards, soldering problems may occur, and moisture intrusion may cause delamination, inner layers and hole walls during the assembly process and/or actual use Separation (open circuit) and other issues.

6. The tolerance of the copper clad laminate meets the requirements of IPC4101ClassB/L. Benefits: Strictly controlling the thickness of the dielectric layer can reduce the deviation of the expected electrical performance.

The risk of not doing this: the electrical performance may not meet the specified requirements, and there will be large differences in output/performance of the same batch of components.

7. Define solder mask materials to ensure compliance with IPC-SM-840ClassT requirements. Benefits: Lianshuo Circuits recognizes "excellent" inks, realizes ink safety, and ensures that solder mask inks comply with UL standards.

Risks of not doing so: Inferior inks can cause adhesion, flux resistance, and hardness problems. All of these problems will cause the solder mask to separate from the circuit board and eventually lead to corrosion of the copper circuit. Poor insulation properties can cause short circuits due to accidental electrical continuity/arcing.

8. Defining the tolerances of shapes, holes and other mechanical features. Benefits: Strictly controlling tolerances can improve the dimensional quality of products-improving fit, shape and function

Risk of not doing this: problems in the assembly process, such as alignment/fitting (the problem of press-fitting pins will only be discovered when the assembly is completed). In addition, due to the increased size deviation, there will be problems when installing into the base.

9. Specify the thickness of the solder mask, although IPC does not have relevant regulations. Benefits: Improve electrical insulation properties, reduce the risk of peeling or loss of adhesion, and strengthen the ability to resist mechanical impact – no matter where the mechanical impact occurs!

Risk of not doing so: Thin solder mask can cause adhesion, flux resistance and hardness problems. All these problems can cause the solder mask to separate from the circuit board and eventually lead to corrosion of the copper circuit. The insulation properties are poor due to the thin solder mask, which can cause short circuits due to unexpected conduction/arc.

10. The appearance requirements and repair requirements are defined, although IPC does not define it. Benefits: Careful care and carefulness in the manufacturing process create safety.

The risk of not doing this: multiple scratches, minor injuries, repairs and repairs-the circuit board works but doesn't look good. In addition to the problems that can be seen on the surface, what are the unseen risks, the impact on assembly, and the risks in actual use?

11. The circuit board factory implements specific approval and ordering procedures for each purchase order. Benefits: The implementation of this procedure can ensure that all specifications have been confirmed.

The risk of not doing this: If the product specifications are not carefully confirmed, the resulting deviation may not be discovered until the assembly or the final product, and it will be too late at this time.

12. PetersSD2955 specifies the brand and model of peelable blue glue. Benefits: The designation of peelable blue glue can avoid the use of "local" or cheap brands.

Risks of not doing so: Inferior or cheap peelable adhesives may foam, melt, crack or solidify like concrete during assembly, making the peelable adhesives unable to peel off/not working.

13. This circuit implements a specific approval for each purchase order and the requirements for the depth of the plug hole in the ordering procedure. Benefits: High-quality plug holes will reduce the risk of failure in the assembly process.

The risk of not doing so: The chemical residue in the gold deposit process can remain in the hole with the plug hole, which will cause problems such as solderability. In addition, there may be tin beads hidden in the holes. During assembly or actual use, the tin beads may splash out and cause a short circuit.

14. Do not accept sets of boards with scrapped units. Benefits: Not using partial assembly can help customers improve efficiency.

Risk of not doing so: All defective boards require special assembly procedures. If the scrap unit board (x-out) is not clearly marked, or if it is not isolated from the board, it is possible to assemble this board. Known bad board, thus wasting parts and time.

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