PCB News - Take you into the LED aluminum substrate

Take you into the LED aluminum substrate

The heat dissipation problem of LEDs is the biggest headache for LED manufacturers, but aluminum substrates can be used because aluminum has high thermal conductivity and good heat dissipation, which can effectively remove internal heat. Aluminum substrate is a unique metal-based copper clad laminate with good thermal conductivity, electrical insulation properties and mechanical processing properties. When designing, it is also necessary to place the PCB as close to the aluminum base as possible to reduce the thermal resistance generated by the potting compound.

First, the characteristics of aluminum substrate

1. Adopt SMT surface mount technology (SMT);

2. Extremely effective treatment of thermal diffusion in the circuit design scheme;

3. Reduce product operating temperature, improve product power density and reliability, and extend product service life;

4. Reduce product volume, reduce hardware and assembly costs;

5. Replace fragile ceramic substrates to obtain better mechanical durability.

Second, the structure of the aluminum substrate

Aluminum-based copper clad laminate is a metal circuit boardmaterial, composed of copper foil, thermally conductive insulating layer and metal substrate. Its structure is divided into three layers:

Cireuitl.Layer circuit layer: equivalent to the copper clad laminate of an ordinary PCB, the thickness of the circuit copper foil is loz to 10oz.

DiELcctricLayer insulating layer: The insulating layer is a layer of low thermal resistance and thermally conductive insulating material.

BaseLayer base layer: is a metal substrate, generally aluminum or copper can be selected. Aluminum-based copper clad laminates and traditional epoxy glass cloth laminates, etc.

The circuit layer (that is, copper foil) is usually etched to form a printed circuit to connect the various components of the component. Generally, the circuit layer requires a large current-carrying capacity, so thicker copper foil should be used, the thickness is generally 35μm~ 280μm; The thermal insulation layer is the core technology of the aluminum substrate. It is generally composed of a special polymer filled with special ceramics. It has low thermal resistance, excellent viscoelasticity, thermal aging resistance, and can withstand mechanical and thermal stress.

The thermal insulation layer of the high-performance aluminum substrate uses this technology to make it have extremely excellent thermal conductivity and high-strength electrical insulation performance; the metal base layer is the supporting member of the aluminum substrate and requires high thermal conductivity, generally aluminum plate, Copper plate can also be used (the copper plate can provide better thermal conductivity), which is suitable for conventional machining such as drilling, punching and cutting. Compared with other materials, PCB materials have incomparable advantages. Suitable for surface mount SMT public art of power components. No radiator is needed, the volume is greatly reduced, the heat dissipation effect is excellent, and the insulation performance and mechanical performance are good.

Third, the use of aluminum substrate:

Purpose: Power Hybrid IC (HIC).

1. Audio equipment: input and output amplifiers, balanced amplifiers, audio amplifiers, preamplifiers, power amplifiers, etc.

2. Power supply equipment: switching regulator, DC/AC converter, SW regulator, etc.

3. Communication electronic equipment: high-frequency amplifier `filtering appliance` transmission circuit.

4. Office automation equipment: motor drives, etc.

5. Automobile: electronic regulator `igniter` power controller, etc.

6. Computer: CPU board, floppy disk drive, power supply device, etc.

7. Power module: converter `solid relay` rectifier bridge, etc.

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