PCB News - Heze multi-layer circuit board: the role and advantages and disadvantages of multi-layer circuit board as immersion gold process

Many friends asked the editor, what is the role of the multi-layer circuit board in the immersion gold process, what are the advantages and disadvantages, and whether to use the immersion gold or the tin-spraying process. Here is a small editor to talk about it in detail.
Heze multilayercircuit board

Multilayer immersion gold circuit boards are used in various electronic product fields and are an indispensable component of electronic products. Electronic components will be installed and soldered on the circuit board to realize its functional value. The most commonly used process is tin or nickel-gold. Now I will mainly introduce the functions, advantages and disadvantages of nickel-gold.

First of all, the reason why the immersion gold process covers the pads of the board, as an important part, must be because nickel-gold is one of the materials that are very easy to weld with tin, and nickel-gold can also protect the copper of the pad. It will be oxidized and corroded by air to protect the circuit board. In addition, the nickel-gold process also meets the environmental protection requirements advocated by various countries. The immersion gold process is a lead-free process (lead-free multi-layer immersion gold circuit board). Customers can use production with confidence.

In addition, because the multi-layer immersion gold circuit board process is chemical immersion gold, the gold covering the surface of the pad is flat, which is also very easy to solder, especially for many high-precision circuit boards nowadays, the processing requirements are very high. If poor soldering causes false soldering, BGA is not so easy to find the cause, and it is troublesome for engineers to repeatedly adjust. Therefore, the multi-layer circuit board immersion gold process can generally avoid this phenomenon, so many precision circuit boards are now Use Immersion Gold Craft to do it only.

But there is also a disadvantage of the immersion gold process, that is, the cost will be more expensive than the general process. As the company's cost consideration, generally not very precise or demanding boards, you can choose to spray lead tin or lead-free tin. After reading the above content, you will know how to choose the processing technology of the circuit board surface treatment?

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