PCB News - How to do the temperature resistance test of PCB board?

How to do the temperature resistance test of PCB board?

In order to ensure the quality of the PCB board, a temperature resistance test is required. Usually the PCB board can withstand a temperature of up to 300 degrees for 5-10 seconds; the approximate temperature is 260 for lead-free wave soldering, and 240 degrees for lead-free soldering. So, how to do the temperature resistance test of PCB board?

1. Prepare PCB prototype and tin furnace.

Sampling 10*10cm substrate (or laminated board, finished board) 5pcs (copper-containing substrate without blistering and delamination); substrate: 10cycle or more; laminated board: LOWCTE15010cycle or more; HTg material: 10cycle or more; Normal material: 5cycle or more ; Finished board: LOWCTE1505cycle or more; HTg material or more 5cycle; Normal material or more 3cycle.

2. Set the temperature of the tin furnace to 288±5 degrees, and use contact temperature measurement to calibrate.
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3. Dip the flux with a soft brush and apply it to the surface of the board; then use crucible tongs to pick up the test board and immerse it in the tin furnace. After timing for 10 seconds, take it out. Visually check whether there is any bubbling and bursting of the board. This is 1 cycle.

4. If there is a problem of blistering and exploding board, immediately stop the immersion tin and analyze the initiation point f/m; if there is no problem, continue the cycle until the board explodes, with 20 times as the end point;

5. The blistering part needs to be sliced to analyze the source of the detonation point and take pictures.

In short, the temperature resistance of PCB circuit boards of different materials needs to be understood in detail, and the maximum temperature limit is not exceeded, so as to avoid the problem of scrapping of PCB circuit boards.

The above is the detailed explanation of the PCB board temperature resistance test, I hope it will be helpful to you.