PCB News - Causes of rough gold surface of immersion gold PCB board and improvement suggestions

Causes of rough gold surface of immersion gold PCB board and improvement suggestions

Shenjin PCB board factory: By adjusting the light agent or current density, the roughness of the copper surface caused by electroplating can be improved. For the unclean copper surface, it can be improved by grinding or horizontal micro-etching to solve the problem of unclean copper surface. The gold surface is rough; as for the immersion gold wire, horizontal micro-etching cannot significantly change its roughness.

Due to the roughness of the nickel surface, the gold surface appears rough after visual observation after the gold is melted. This failure mode poses a greater risk to product reliability, and potential failure risks of poor tin application may occur when soldering on the client. The possible causes of potential failure are as follows:

1. Potion performance factors, especially when the new tank is equipped, are very easy to appear. This failure can only be improved with the cooperation of the syrup manufacturers, which can be adjusted and improved mainly from the ratio of M agent, the amount of D agent added, and the plating activity during tank preparation.

2. The deposition rate of the nickel bath is too fast. By adjusting the composition of the nickel bath potion, the deposition rate can be adjusted to the median value required by the potion merchant.

3. Nickel tank syrup is aging or organic pollution is serious, and the tank should be changed regularly according to the requirements of the syrup dealer.

4. The nickel bath is severely plated with the precipitation of nickel, and the nitrate bath and the new matching bath shall be arranged in time.

5. The protection current is too high. Check whether the anti-precipitation device is working normally and whether the plated parts are in contact with the tank wall, and correct it in time.

On the other hand, the imbalance of the nickel tank potion will also lead to loose or rough deposits. The main reason for the rough deposits is that the accelerator is too high or the stabilizer is too little. As for how to improve, you can add a stabilizer to the experimental beaker, press 1m/L, 2m /L,3m/L for comparison experiment. Through the comparison, it can be found that the nickel surface gradually becomes brighter. As long as the appropriate ratio is found, the stabilizer is added to the nickel cylinder to test the plate and re-produce.

The above is the reason for the rough gold surface of the Shenjin PCB board shared by the editor and suggestions for improvement. I hope it will help you!

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