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What is the principle of PCB plating?
We know in the process that electroplating is an important part of PCBA, which can prevent the PCB circuit board from being exposed to the air for a long time, losing its luster due to oxidation, and losing solderability due to corrosion. So what is the principle of PCB electroplating? Today we'll find out.
The principle of PCB electroplating includes four aspects: PCB electroplating solution, PCB electroplating reaction, electrode and reaction principle, and metal electrodeposition process.
First, PCB electroplating solution has six elements: main salt, complexing agent, additional salt, buffer, anode activator and additives.
The electrochemical reaction in the PCB electroplating reaction: the part to be plated is the cathode, which is connected to the negative electrode of the DC power supply, the metal anode is connected to the positive electrode of the DC power supply, and both the anode and the cathode are immersed in the plating solution. When a certain potential is applied between the anode and the cathode, the following reaction occurs at the cathode: the metal ion Mn+ that diffuses from the inside of the plating solution to the interface between the electrode and the plating solution obtains n electrons from the cathode and is reduced to metal M. On the other hand, at the anode, a reaction that is completely opposite to that of the cathode occurs, that is, the dissolution of metal M occurs at the anode interface, releasing n electrons to generate metal ions Mn+.
This is the electroplating principle in the PCBA processing process. Of course, the more detailed principle is placed in the electrochemical course, but it takes a semester to learn. The brief explanation in this article is for your reference only.
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