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FPC flexible circuit board production process
FPC flexible circuit boards have a very wide range of applications. Some circuits and electronics are used in automobiles. There are double-sided and single-sided flexible circuit boards. The production processes of single-sided and double-sided flexible circuit boards are different. The following is The corresponding production process.
FPC double-sided circuit board production process:
Cutting-Drilling-PTH-Plating-Pretreatment-Applying dry film-Aligning-Exposure-Developing-Graphic plating-Removing film-Pretreatment -Paste the cover film-Pressing-Curing-Immersion of nickel and gold-Printing characters-Cutting-Electrical measurement-Punching-final inspection-Packing-shipping
FPC single-sided circuit board production process:
Cutting - Drilling - Pasting Dry Film - Aligning - Exposure - Developing - Etching - Stripping - Surface Treatment - Covering Film - Pressing - Curing - Surface Treatment - Immersion of Nickel and Gold - Printing Characters - Cutting - Electrical Testing - Punching Cutting-final inspection-packaging-shipping
The production process of FPC flexible circuit boards is roughly as described by the circuit board manufacturers above. Although there are differences between single-sided and double-sided, the principle of production is still the same.
iPCB is a high-tech manufacturing enterprise focusing on the development and production of high-precision PCBs. iPCB is happy to be your business partner. Our business goal is to become the most professional prototyping PCB manufacturer in the world. Mainly focus on microwave high frequency PCB, high frequency mixed pressure, ultra-high multi-layer IC testing, from 1+ to 6+ HDI, Anylayer HDI, IC Substrate, IC test board, rigid flexible PCB, ordinary multi-layer FR4 PCB, etc. Products are widely used in industry 4.0, communications, industrial control, digital, power, computers, automobiles, medical, aerospace, instrumentation, Internet of Things and other fields.
