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Why the circuit board after soldering must be cleaned
No matter the performance of the flux is more or less corrosive, the residues and residues after soldering on the circuit board will cause corrosion, leakage, ion migration and other different problems. Therefore, the removal of flux residues will of course be regarded as an important processing task by the industry. And what is the effect of the treatment? Let's let the editor of Shenzhen Circuit Board Factory work with you to understand that there is also a need for appropriate methods for verification and tracking in this regard.
The cleaning effect of the circuit board after soldering should be based on the amount of residual ion residue in the solder joint. The specification adopted by MIL is MIL-P-28809, 55110, and it should have a resistivity above 6MQ-cm in the test. Calculate the resistivity after cleaning the unit area of the metal to be measured and quantitatively. In terms of cleanliness, the resistance should be maintained above 2MQ-cm.
Representative cleanliness testing methods include Ionogurafu and omegaMeter, which are recognized as simple methods for measuring cleanliness in the MIL specification. The principle of any method is that ionic dirt remains on the solder joints after cleaning treatment, and the change in electrical conductivity is measured as an index through solvent extraction.
The cleanliness measurement method of Ionogufafu method is to immerse the metal to be measured in a solution with high resistivity (lsoburobiruarukoru 75% distilled water 25%). After the ionic substances in the pollutants are extracted, the cleanliness is obtained by the change in the conductivity of the solution. . The cleanliness index is based on the calculated sodium chloride equivalent, which represents the pollution degree of ions (ugNaCI/Cm2). In this method, if the residue cannot be dissolved in lsoburobiruarukoru, the degree of contamination cannot be measured.
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