PCB News - Why do you need high-density circuit boards

Why do you need high-density circuit boards

Traditional circuit boards are often divided into single-sided PCB boards, double-sided circuit boards, and PCB multi-layer boards, while PCB multi-layer boards are divided into single-press and multiple-press structures. Of course, this design involves some electrical properties and link density issues, but because of the rapid advancement of electronic product technology, these geometric structures cannot meet the component mounting density and electrical requirements. In order to increase the link density of components, from a geometric point of view, only by compressing the space of lines and connection points, can more contacts be accommodated in a small space to increase the link density. Of course, multiple components can also be stacked in one position to increase the assembly density. Therefore, high-density circuit boards are not only a circuit board technology, but also an issue of electronic assembly and assembly.

In order to increase the connection density of components, from a geometrical point of view, only by compressing the space between the circuit and the connection point and allowing more contacts to be accommodated in a smaller space can the connection density be increased. Of course, there is another different idea, that is, multiple different components can be stacked in the same position to increase the density of the structure. Therefore, from a certain point of view, high-density circuit boards are not only a technical problem of circuit boards, but also a problem of electronic construction and assembly. I am afraid that this aspect is worthy of the industry's efforts to understand.

The so-called electronic package generally refers to the connection between the semiconductor chip and the carrier board. In this regard, the Civil Road Board Association has published a book on "Electronic Structure Loading Board Technology", and those who are interested can refer to it. As for the electronic assembly part, it is the work of reinstalling the components after the electronic assembly is completed on another functional circuit board. This connection is generally called OLB (outerleadbond), which refers to the connection part of the external pin of the component. The connection of this part is directly related to the surface contact density of electronic components. When the functions and integration of electronic products are getting higher and higher, and at the same time, the demand for mobility, thinness, and multi-function continues to increase., Of course, there will be high-density pressure.

If the concept of high-density circuit board design is adopted, electronic products can obtain the following benefits:

1. The high-density circuit board structure uses a thinner dielectric thickness, and the potential inductance is relatively low.

2. The micro-hole has a low aspect ratio, and the signal transmission reliability is higher than that of the general through-hole.

3. The micro-hole can improve the flexibility of the circuit configuration and make the circuit design easier.

4. The same product design can reduce the number of carrier boards, increase density and reduce costs.

5. The use of micro-hole interconnection can shorten the contact distance, reduce signal reflection, and crosstalk between lines, and the components can have better electrical performance and signal accuracy.

6. Increasing the wiring density and increasing the circuit capacity per unit area with micro-hole fine wires can meet the assembly requirements of high-density contact components and facilitate the use of advanced structures.

7. The high-density circuit board microvia technology allows the carrier board design to shorten the distance between grounding and signal layers, thereby improving radio frequency/electromagnetic wave/electrostatic discharge (RFI/EMI/ESD) interference. It can also increase the number of grounding wires to prevent components from being damaged by instantaneous discharge caused by static electricity accumulation.

Modern and popular electronic products must not only be mobile and energy-saving, they must also be unburdened to wear and beautiful in appearance. Of course, the most important thing is that they are affordable and can be replaced with fashion.