PCB News - Talking about the production process of each layer of circuit board

Talking about the production process of each layer of circuit board

This article mainly introduces: single-sided circuit board, double-sided circuit board sprayed tin plate, double-sided circuit board plated nickel gold, multilayer circuit board sprayed tin plate, multilayer circuit board nickel-plated gold, multilayer circuit board immersed nickel gold Board; The production process of each layer of circuit board is introduced in detail.

1. Single-sided circuit board process: blanking and edging - drilling - outer layer graphics - (full board gold plating) - etching - inspection - silk screen solder mask - (hot air leveling) - silk screen characters - shape processing - test - inspection.

2. The process flow of double-sided circuit board tin spraying board blanking and grinding - drilling - sinking copper thickening - outer layer graphics - tinning, etching tin removal - secondary drilling - inspection - silk screen solder mask - gold-plated plug - hot air Leveling-Silk-printed characters-Shape processing-Test-Inspection.

3. The process flow of nickel and gold plating on double-sided circuit boards is blanking and grinding - drilling - heavy copper thickening - outer layer graphics - nickel plating, gold removal and etching - secondary drilling - inspection - silk screen solder mask - silk screen characters - Shape processing-test-inspection.

4. Multi-layer circuit board tin spraying board process cutting edge grinding - drilling positioning hole - inner layer pattern - inner layer etching - inspection - blackening - lamination - drilling - heavy copper thickening - outer layer pattern - tinning, Etching tin removal-secondary drilling-inspection-screen printing solder mask-gold-plated plug-hot air leveling-screen printing characters-shape processing-test-inspection.

5. Multilayer circuit board nickel-gold plating process: blanking and edge grinding - drilling positioning holes - inner layer graphics - inner layer etching - inspection - blackening - lamination - drilling - sinking copper thickening - outer layer graphics - gold plating, Film removal and etching-secondary drilling-inspection-screen printing solder mask-screen printing characters-shape processing-test-inspection.

6. Multi-layer circuit board nickel-gold plate process: blanking and edge grinding - drilling positioning hole - inner layer pattern - inner layer etching - inspection - blackening - lamination - drilling - sinking copper thickening - outer layer pattern - plating Tin, etching tin removal-secondary drilling-inspection-screen printing solder mask-electroless nickel deposition-screen printing characters-shape processing-test-inspection. 

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