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PCB News - Design Suggestions for Laminated Structure of Multilayer Circuit Board Factory

PCB News

PCB News - Design Suggestions for Laminated Structure of Multilayer Circuit Board Factory

Design Suggestions for Laminated Structure of Multilayer Circuit Board Factory

2021-08-28
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Author:Aure

Design Suggestions for Laminated Structure of Multilayer Circuit Board Factory

With the development of electronics, before designing multilayer circuit boards, engineers need to determine the circuit board structure used according to the circuit scale, circuit board size and electromagnetic compatibility requirements, that is, to decide to use 4-layer PCB board, 6 Layer circuit boards, eight-layer circuit boards or more circuit boards.

More and more functions are required for products, and the structure of PCB circuit boards is becoming more and more complicated.

Multilayer circuit board factories usually refer to the "stacked design", which is actually the design of the superimposed arrangement of the wiring layer and the plane layer.

Design Suggestions for Laminated Structure of Multilayer Circuit Board Factory


We have been in the production of PCB circuit boards for 15 years, and our circuit board manufacturing capabilities are all produced by advanced equipment processing and humanized management. Multi-layer circuit boards have a wealth of technical deposits. Multi-layer circuit board factories are electronic products developed in the direction of high-precision electronic technology. As a professional multi-layer circuit board manufacturer, we will continue to improve the production process and strive for the rise of the national entity manufacturing industry.

iPCB is a high-tech manufacturing enterprise focusing on the development and production of high-precision PCBs. iPCB is happy to be your business partner. Our business goal is to become the most professional prototyping PCB manufacturer in the world. Mainly focus on microwave high frequency PCB, high frequency mixed pressure, ultra-high multi-layer IC testing, from 1+ to 6+ HDI, Anylayer HDI, IC Substrate, IC test board, rigid flexible PCB, ordinary multi-layer FR4 PCB, etc. Products are widely used in industry 4.0, communications, industrial control, digital, power, computers, automobiles, medical, aerospace, instrumentation, Internet of Things and other fields.