PCB News - Several major trends in the development and innovation of PCB technology in Guangdong Circuit Board Factory

With the rapid development of electronic technology, only by recognizing the development trend of PCB technology, circuit board manufacturers can actively develop and innovate production technology in order to find a way in the fiercely competitive PCB industry. Circuit board manufacturers must always maintain the awareness of development. The following are some views on the development of PCB production and processing technology in Changsha:
1. Develop component embedding technology
Component embedding technology is a huge change in PCB functional integrated circuits. The formation of semiconductor devices (called active components), electronic components (called passive components) or passive components on the inner layer of the PCB has begun. Production, but to develop circuit board manufacturers must first solve the analog design method, production technology and inspection quality, reliability assurance is also a top priority. Changsha PCB circuit board factory must increase resource investment in systems including design, equipment, testing, and simulation in order to maintain strong vitality.
Several major trends in the development and innovation of PCB technology in circuit board factories

2. HDI PCB technology is still the mainstream development direction
HDI PCB technology promotes the development of mobile phones, drives the development of information processing and control basic frequency functions of LSI and CSP chips (packages), and the development of template substrates for circuit board packaging. It also promotes the development of PCBs. Therefore, circuit board manufacturers must follow the HDI road Innovate PCB production and processing technology. As HDI embodies the most advanced technology of contemporary PCB, it brings fine wire and small aperture to PCB board. HDI multi-layer board application terminal electronic products-mobile phones (mobile phones) is a model of HDI cutting-edge development technology. In mobile phones, PCB motherboard micro-wires (50μm～75μm/50μm～75μm, wire width/spacing) have become the mainstream. In addition, the conductive layer and board thickness are thinner; the conductive pattern is refined, which brings high-density and high-performance electronic equipment .

3. Continuously introduce advanced production equipment and update the circuit board manufacturing process
HDI manufacturing has matured and tends to be perfected. With the development of PCB technology, although the commonly used subtractive manufacturing methods in the past still dominate, low-cost processes such as additive and semi-additive methods have begun to emerge. Using nanotechnology to make holes metallized and simultaneously form PCB conductive patterns, a novel manufacturing process method for flexible boards. High-reliability, high-quality printing method, inkjet PCB process. Production of fine wires, new high-resolution photomasks and exposure devices, and laser direct exposure devices. Uniform plating equipment. Production component embedded (passive active component) manufacturing and installation equipment and facilities.
Several major trends in the development and innovation of PCB technology in circuit board factories
4. Develop higher performance PCB raw materials
Whether it is a rigid PCB circuit board or a flexible PCB circuit board material, with the globalization of lead-free electronic products, these materials must be required to have higher heat resistance, so the new type of high Tg, small thermal expansion coefficient, small dielectric constant, and dielectric loss More tangent and excellent materials continue to emerge.
5. Bright prospects for photoelectric PCB
The photoelectric PCB circuit board uses the optical path layer and the circuit layer to transmit signals. The key to this new technology is to manufacture the optical path layer (optical waveguide layer). It is an organic polymer that is formed by methods such as flat plate photocopying, laser ablation, and reactive ion etching. At present, this technology has been industrialized in Japan and the United States. As a major production country, Chinese PCB manufacturers should also actively respond and keep up with the pace of scientific and technological development.