Rogers RO4725 PCB Circuit Board

Rogers RO4725JXR, RO4730JXR, RO4730G3 Antenna Grade PCB material specification

The RO4700 series antenna grade PCB material is a reliable and low-cost material, which can be used as a substitute for the traditional PTFE PCB material.

RO4725JXR, RO4730JXR, and RO4730G3PCB materials possess the mechanical and electrical properties required by antenna designers. The dielectric constants (Dk) of these PCB materials are 2.55 and 3.0, and the loss tangent angle (Df) is 0.0022. These values minimize the loss of signal while allowing the antenna designer to achieve considerable gain. This series of materials can provide excellent PIM performance with a value less than -160dBc (measured at 43dBm input power at 1900MHz signal).

The R04700 series antenna grade PCB material is compatible with traditional epoxy resin and a high-temperature lead-free welding process. These PCB materials do not require the special treatment required by the traditional PTFE-based materials, such as pre-treatment by plating holes. Multilayer plates can be formed by pressing together with R04400-bonded sheets at 175 C. The resin system of R04700JXR series materials is designed to provide antenna designers with the performance they seek. The glass transition temperature of these materials exceeds 280T (536K), so the Z-axis CTE is very low, and the reliability of plating through holes and the processability of lead-free soldering are better.

RO4725 antenna level plate is a reliable and low-cost alternative to the traditional PTFE PCB.

The RO4725 LoProPCB material has the mechanical and electrical properties required by the antenna designer. The dielectric constant (Dk) of PCB material measured at 2.5 GHz is 2.55 and the tangent of loss angle (Df) is 0.0022. These values allow the antenna designer to achieve significant gain while minimizing signal loss. The material has low PIM performance and is superior to -153 dBc (using Rogers internal test method).

RO4725 LoPro antenna grade PCB material is compatible with traditional epoxy resin and high-temperature lead-free welding process. These PCB materials do not require special treatment of the traditional PTFE base plate to prepare electroplated holes. The resin system of RO4725 material is designed to provide the performance that antenna designers are pursuing. The glass transition temperature of RO4725 material exceeds 280 C (536 F), which results in lower Z-axis CTE and excellent pore permeability reliability.

Model

RO4700, RO4725JXR, RO4730JXR, RO4730G3, RO4700, RO4725JXR, RO4730JXR, RO4730G3, RO4700JXR

4725 24X18 1TC/1TC 0307+-002/DI, 4725 24X18 1TC/1TC 0457+-003/DI, RO4725, 4725 48X36 1TC/1TC 0607+-004/DI, 4725 48X36 1TC/1TC 0307+-002/DI, 4725JXR 24X18 1TC/1TC 0307+-002/DI, RO4700, RO4725 LoPro

Rogers formally introduced RO4730G3 antenna-grade PCB material with standard electrolytic copper foil and UL 94 V-0 to meet the performance requirements of current and future active antenna arrays and small base station applications, especially for the Internet of Things (IoT) and the emerging 5G wireless communication system. RO4730G3 has a wide range of copper foils to choose from, allowing more flexibility in design and a better combination of performance and cost.

RO4730G3 PCB material is a ceramic-filled hydrocarbon circuit board material, originally introduced with standard low roughness, low loss LOPro ® Copper foil. Lopro copper foil provides excellent passive intermodulation (PIM) performance (usually better than -160 dBc) and has been widely used in IM-sensitive high-frequency antennas. With the optimization of 5G design, PIM has become less important in some applications. The standard electrolytic copper option of RO4730G3PCB material is introduced, which provides an excellent combination of price, performance, and durability.

The RO4730G3 PCB material uses the antenna engineer's preferred low dielectric constant (DK), which is DK 3.0 in the thickness direction at 10GHz frequency with a tolerance of +0.05. The PCB material is 30% lighter than polytetrafluoroethylene and has a high glass transition temperature (Tg) of more than +280 C, making it better compatible with the automatic assembly process. The PCB material of the RO4730G3 line has a low Z-axis thermal expansion coefficient (CTE) and only 30.3 ppm/C in the temperature range from -55 C to +288 C, which ensures reliability of electroplating through hole (PTH) in multi-layer circuit processing and is compatible with the lead-free process.

The dielectric constants of antenna grade plates AD255C and RO4725JXR are 2.55, but the difference between them is: AD255C is a polytetrafluoroethylene material with glass cloth, the loss factor is 0.0011, the PCB is soft, and processing is difficult; RO4725JXR is a hydrocarbon and ceramic filler with a loss factor of 0.0026. The board is hard and easy to process.

ROGERS RO4725 and ROGERS RO4725JXR are two models. RO4725JXR is an improvement based on RO4725 and has a lower PIM value. It is especially suitable for communication antenna panels.