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Rogers 3001 adhesive film is a thermoplastic chlorofluoro copolymer. It is recommended to connect low dielectric constant polytetrafluoroethylene (Teflon fluorocarbon polymer) microwave stripline packages and other multilayer circuits. It can also be used to combine other structures and electrical components with dielectrics.
3001 bonding film has low dielectric constant and low loss tangent at microwave frequency, ensuring
Minimal interference with the electrical functions of bonded ribbon lines and other multilayer structures. Compatible with Rogers RT/duroid low dielectric constant laminate, ULTRALAM woven glass/PTFE microwave circuit laminate, RO3000 series high frequency circuit materials, RT/duroid6002 ceramic filled circuit materials, and other low dielectric constant based on PTFE Substrate.
Using off-the-shelf equipment in the printed circuit manufacturing industry, the 3001 bonding film can achieve reliable connections. Laminating technology is familiar to most circuit manufacturing shops. The film is easily cut to size and can be punched for tool slots and surface-mounted transmitters.
The thickness of 3001 bonded FI-lm is 0.0015" (0.0381mm), continuous 12" (305mm)
