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PCB Material List

PCB Material List - Shengyi IC packaging products SI10U(S)

PCB Material List

PCB Material List - Shengyi IC packaging products SI10U(S)

Shengyi IC packaging products SI10U(S)

Shengyi IC packaging products SI10U(S)


SI10U Characteristic: Low CTE and high modulus can effectively reduce the warpage of packaging substrate, Excellent heat and humidity resistance, Good PCB processability, Halogen free materials.


SI10U Application area: eMMC, DRAM, AP, PA, Dual CM, Fingerprint, RF Module.


ItemsConditionUnitSI10U(S)
TgDMA degree Celsius280
Td5% wt. loss degree Celsius
>400
CTE (X/Y-axis)Before Tgppm/ degree Celsius
10
CTE (Z-axis)
α1/α2ppm/ degree Celsius
25/135
Dielectric Constant 1) (1GHz)2.5.5.9-4.4
Dissipation Factor 1) (1GHz)
2.5.5.9-0.007
Peel Strength1)1/3 OZ, VLP CuN/mm
0.80
Solder Dipping@288 degree Celsiusmin>30
Young's modulus50 degree CelsiusGPa26
Young's modulus
200 degree CelsiusGPa
23
Flexural Modulus1)50 degree Celsius
GPa
32
Flexural Modulus1)
200 degree Celsius
GPa
27
Water Absorption1)
A%0.14
Water Absorption1)85 degree Celsius/85%RH,168Hr%
0.35
Flammability
UL-94Rating
V-0
Thermal Conductivity-W/(m.K)0.61
Color--Black

ipcb company has matured to use SI10U to produce IC Substrate board in batches.