Shengyi IC packaging products SI10U(S)
SI10U Characteristic: Low CTE and high modulus can effectively reduce the warpage of packaging substrate, Excellent heat and humidity resistance, Good PCB processability, Halogen free materials.
SI10U Application area: eMMC, DRAM, AP, PA, Dual CM, Fingerprint, RF Module.
Items | Condition | Unit | SI10U(S) |
---|---|---|---|
Tg | DMA | degree Celsius | 280 |
Td | 5% wt. loss | degree Celsius | >400 |
CTE (X/Y-axis) | Before Tg | ppm/ degree Celsius | 10 |
CTE (Z-axis) | α1/α2 | ppm/ degree Celsius | 25/135 |
Dielectric Constant 1) (1GHz) | 2.5.5.9 | - | 4.4 |
Dissipation Factor 1) (1GHz) | 2.5.5.9 | - | 0.007 |
Peel Strength1) | 1/3 OZ, VLP Cu | N/mm | 0.80 |
Solder Dipping | @288 degree Celsius | min | >30 |
Young's modulus | 50 degree Celsius | GPa | 26 |
Young's modulus | 200 degree Celsius | GPa | 23 |
Flexural Modulus1) | 50 degree Celsius | GPa | 32 |
Flexural Modulus1) | 200 degree Celsius | GPa | 27 |
Water Absorption1) | A | % | 0.14 |
Water Absorption1) | 85 degree Celsius/85%RH,168Hr | % | 0.35 |
Flammability | UL-94 | Rating | V-0 |
Thermal Conductivity | - | W/(m.K) | 0.61 |
Color | - | - | Black |
ipcb company has matured to use SI10U to produce IC Substrate board in batches.