TPH-1/2 is made of a new type of inorganic and organic materials,with special process and compounding.
The advantage of design for microwave circuit using TPH-1/2 here:
(1)The substrate is black. The dielectric constant is 2.65,with consistent performance over broad temperature and frequency ranges. The operating temperature is -100 degree Celsius~+150 degree Celsius;
(2)The peel strength between the copper and the substrate is more reliable than the vacuum film coating of ceramic substrate. This substrate is created to offer customers easy for circuit processing,higher pass-rate of production,and the manufacturing cost is much lower than the ceramic substrate.
(3)Dissipation factor tgδ≤1*10-3,and the loss has a slight variation with the rise of the frequency.
(4)It is easy for mechanical manufacturing,including drill, punch, grind, cut, etching,etc.. For these,the ceramic substrate cannot be compared.
(5) Due to the specific gravity less,the remarkable characteristics of the module are weight lighter manufacturing by this substrate,which but other materials cant compare.
(6)Copper thickness is:0.035μm
TPH-1/2 Technical Specifications
Appearance | Smooth and neat on both sides: no stain,scratch and dent. | |||||
Dimension and tolerance (mm) | Dimensions and Tolerance | |||||
160*160±2mm 200*200±2mm | ||||||
Thickness and Tolerance | ||||||
δ(mm):2.5±0.075,3.0±0.1,4.0±0.1,5.0±0.2,6.0±0.12,7.0±0.15,8.0±0.15,9.0±0.2,10.0±0.2,12.0±0.2 | ||||||
For special dimensions,customized lamination is available. | ||||||
Mechanical Strength | Peel strength | In normal state:≥6N/cm;In the environment of alternating humidity and temperature:≥4 N/cm . | ||||
Chemical Property | According to the properties of laminate,the chemical etching method for PCB can be used. The dielectric properties of materials are not changed. | |||||
Electrical property | Name | Test condition | Unit | Value | ||
Density | Normal state | g/cm3 | 1.05 | |||
Moisture Absorption | Dip in distilled water of 20±2 degree Celsius for 24 hours | % | ≤0.02 | |||
Operating Temperature | High-low temperature chamber | degree Celsius | -100~+150(Processing temperature should not exceed 200 degree Celsius) | |||
Thermal Conductivity | -55~288 degree Celsius | W /m /k | 0.3 | |||
CTE | 0~100 degree Celsius | ppm/ degree Celsius | 50(x,y,z) | |||
Shrinkage Factor | 2 hours in boiling water | % | 0.0004 | |||
Surface Resistivity | M.Ω | ≥1*106 | ||||
Volume Resistivity | Normal state | MΩ.cm | ≥1*109 | |||
Constant humidity and temperature | ≥1*106 | |||||
Pin Resistance | 500V DC | Normal state | MΩ | ≥1*106 | ||
Constant humidity and temperature | ≥1*101 | |||||
Dielectric Breakdown | kv | ≥20 | ||||
Dielectric Constant | 10GHZ | εr | 2.65(±2%) | |||
Dissipation Factor | 10GHZ | tgδ | ≤1*10-3 |
printed circuit board(PCB) with radio frequency(RF PCB) are an increasingly used technique within the PCB industry.
--RF PCB with a high frequency with works above 100 MHz.
--Microwave Circuit with works above 2 GHz radio frequency.
RF-pcb’s are used in different applications such as remote controls(wireless controls)security,smartphones,sensors etc.
New technologies make more and more use of these RF applications.
This asks for a manufacturing according to high quality standards and choosing the right RF materials depending on the application.
It is important that one knows the properties of the various materials. Choosing the right material is perhaps the most critical decision in the production process of the RF PCB.
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