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F4BTMS-2 is the PTFE PCB composites, laminated by the Nano-ceramic filled reinforced with the ultra thin woven fiberglass, according to the scientific formulation and strict process control. On the basis of the original PTFE copper-clad laminates,the material formula and manufacturing process were improved. The content of fiberglass is very small, which can replace the same type of foreign high frequency circuit materials.
F4BTMS-2 Data sheet
Appearance | Meet the specification requirements for the laminate of microwave PCB by National and Military Standards. | |||||||
Types | F4BTMS-2 | |||||||
Dielectric Constant | 2.2±0.03 2.65±0.04 2.94±0.04 3.0±0.04 | |||||||
Dimension(mm) | 305X460 460X610 500X600 460X1220 | |||||||
For special dimension,customized laminates is available. | ||||||||
Thickness and Tolerance(mm) | Dielectric thickness | 0.127 | 0.254 | 0.508 | 0.762 | 1.016 | 1.524 | 2.29 |
Tolerance | ±0.015 | ±0.02 | ±0.03 | ±0.04 | ±0.05 | ±0.05 | ±0.08 | |
Special thickness can be customized. | ||||||||
Optional copper foil | Thickness: 0.5 OZ , 1OZ | |||||||
Type: ED, VLP foil, HVLP foil, 50 Wresistive foil | ||||||||
Mechanical Strength | Peel strength (1oz copper) >15N/cm | |||||||
Thermal stress | After tin dipping, 280°C, 10s, ≧3times,no de-lamination and blister. | |||||||
Chemical Property | According to the properties of laminate,the chemical etching method for PCB can be used. The dielectric properties of laminate are not changed. | |||||||
Electrical Property | Name | Test condition | Unit | Value | |||
Density | DK2.2 | Normal atmospheric temperature | g/ cm3 | 2.18 | |||
DK2.65 | Normal atmospheric temperature | g/ cm3 | 2.25 | ||||
DK2.94, 3.0 | Normal atmospheric temperature | g/ cm3 | 2.3 | ||||
Moisture Absorption | Dip in the distilled water of 20±2°C for 24 hours | % | 0.02 | ||||
Operating Temperature | High-low temperature chamber | °C | -50~+260 | ||||
Thermal Conductivity | W/m/k | 0.72 | |||||
CTE (typical) | -55 o~288oC DK2.2 | ppm/oC | X | Y | Z | ||
15 | 16 | 35 | |||||
-55 o~288oC DK2.65 | ppm/oC | X | Y | Z | |||
12 | 13 | 25 | |||||
-55 o~288oC DK2.94, 3.0 | ppm/oC | X | Y | Z | |||
10 | 11 | 22 | |||||
Shrinkage Factor | 2 hours in boiling water | % | <0.0002 | ||||
Surface Resistivity | 500V DC | Normal state | M.Ω | ≥1*107 | |||
Constant humidity and temperature | ≥1*106 | ||||||
Volume Resistivity | Normal state | MΩ.cm | ≥1*108 | ||||
Constant humidity and temperature | ≥1*107 | ||||||
Thermal Coefficient of εr | -50 o~150oC | PPM/ oC | -20 | ||||
Dissipation Factor DK2.2/2.65/2.94/3.0 | 10GHZ | Df | 0.0011 | ||||
UL Flammability Rating | 94V-0 | ||||||
F4BTMS-2 Features:
1. Excellent dielectric constant tolerance and consistency,low dissipation factor;
2. The coefficient of dielectric constant and dielectric loss changing with temperature is smaller ,and the frequency stability is better.
3. The coefficient of thermal expansion in X / Y / Z direction is reduced, and the coefficient of thermal expansion in X / Y direction is consistent.
4. The thermal conductivity is increasing;
5. Good dimensional stability;
6. Good appearance and smooth surface;
7. Suitable for high frequency multilayer lamination; 8. Excellent heat resistance and adhesion.
F4BTMS-2 Application:
Aerospace devices, High reliability equipment, Military radar, Phased array antenna, Feed network antenna, Satellite communication equipment, Passive components, Base station antennas, Ground and air radar systems, GPS antenna, Power backplane, Multilayer PCB, and Bunching network.
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